BGA Assembly
BGA Assembly
Your Leading BGA Assembly Manufacturer in China
- Advanced BGA Capability: Specialized SMT lines are designed for accurate BGA assembly, processing sophisticated BGA PCB designs in high quantities.
- Full BGA Service: A one-stop-shop BGA PCB Assembly service that includes necessary DFM/DFA checkup for BGA Components, purchase, and complete project assistance.
- Certified BGA Quality: We guarantee BGA Assembly quality via ISO certifications and critical inspection techniques such as X-ray and AOI for accurate BGA PCB results.
Do you need more connections in a compact printed circuit board area? BGA Components provide a strong solution for contemporary electronics. Learn about BGA Assembly, an important process for installing these advanced components. Understand how SMTFAB BGA PCB Assembly Service can deliver your project better results.
What is Ball Grid Array (BGA) Assembly?
What is a BGA Assembly’s basic function? The advanced process uses specialized methods to place complex integrated circuits on circuit boards. These particular chips, known as BGA Components, differ from regular parts by having solder balls on their bottom surface. The bottom side of these arrays shows multiple tiny solder balls. The ball grid array design helps make BGA technology more helpful.
Through BGA PCB Assembly, we place the electronic parts exactly where they need to be on the PCB. Solder joint connections form perfectly during reflow soldering. The board enters a special oven where solder balls align uniformly. As the solder balls cool down, they become firm electrical links between the chip and the PCB board. Special X-ray scans must verify every joint type under the surface. This method allows today’s small electronic devices to contain more performance features than earlier technology setups.
What are the Advantages of a BGA Assembly?
Improved Performance & Space Efficiency
The direct chip connections and placement underneath the board boost BGA PCB signal speed and thermal performance while freeing up more space.
Reduced Board Thickness
Using BGA technology lets engineers reduce product size because circuits stay close to the board instead of extending through long wire leads.
Enhanced Durability
You reduce the chances of accidental lead damage when handling or operating, since the strong solder balls employed for BGA Components are much more durable than conventional leads, resulting in fewer repairs.
High Connection Density
This technology is ideal when connecting tiny packages with a very high pin count, since BGA PCB Assembly supports many more input/output connections in a smaller area.
Better Solderability & Faster Assembly
Because BGA Components stay centered during reflow soldering, they create regular solder joints faster, resulting in streamlined BGA PCB Assembly processing.
Efficient Heat Dissipation
You enjoy better thermal performance since the low thermal resistance path formed by the solder balls enables heat to be transferred efficiently from the BGA Components directly into the BGA PCB.
BGA Assembly Process
Carrying out a successful BGA PCB Assembly requires some important steps. We follow this exact process to produce dependable output. This guarantees your BGA Components work flawlessly on the BGA PCB. Look at how this procedure happens step by step.
- PCB Preparation
We start by preparing your BGA PCB with accurate amounts of solder paste. This paste is applied to the pads where the BGA Components will reside.
- BGA Placement
We then place the BGA Components accurately on top of the solder paste positions. Specialized automated pick-and-place machines perform the exact task of BGA Assembly.
- Reflow Soldering
The ready BGA PCB proceeds into a dedicated reflow oven. Precise temperature warms up the solder paste and the solder balls, forming solid electrical bonds for the BGA Assembly.
- Cooling and Inspection
Once soldering is complete, the board is cooled to set the temperature of the joints. Most importantly, we examine the BGA PCB Assembly using techniques such as AOIs and X-rays to identify any defects that may be concealed.
- Secondary Processes
Lastly, as per your requirements, we undertake secondary operations. The team performs basic maintenance tasks such as cleaning the board, running tests for functionality, and applying conformal coatings on the assembly surface area of the BGA.
Applications of BGA Assembly
Automotive
Do you need more electronics functionalities in your car systems? BGA Assembly provides increased package density on the BGA PCB. The technique lets engineers combine advanced functions into their devices, particularly navigation systems. Automotive applications enjoy the efficiency and performance improvement provided by BGA PCB Assembly. It integrates more power into compact spaces.
Aerospace
Heat management plays an important role in your aerospace work. BGA Assembly creates a better heat management system that is needed for advanced aerospace technology. A BGA PCB’s superior heat management capacity is appropriate for dynamic environments. Aerospace depends on the strong thermal cycling endurance of quality BGA PCB Assembly. It guarantees reliability under harsh conditions.
Industrial Equipment
Thermal stability is necessary for your industrial parts. Industrial components benefit from the strong design of BGA Assembly. Without fear, you can apply BGA PCB designs in motor drives and control systems. The technology guarantees dependable operation where high heat stability is necessary. Trust BGA PCB Assembly for industrial uses.
Computer and Mobile Devices
Are you assembling small computers or mobile phones? BGA Assembly is ideal as it requires minimal space and has good heat dissipation. Low impedance optimizes performance in these units. Using BGA components on a BGA PCB directly helps achieve thinner, lighter portable designs. It provides the flexibility of today’s computing units.
SMTFAB BGA Assembly Capabilities
| Capability Area | Details / Supported Options |
| Supported BGA PCB Types | Including Plastic (PBGA), Ceramic (CBGA), Micro BGA (MBGA), Stacked, Lead/Leadless, CTBGA, CABGA, VFBGA, LGA, CSP, WLCSP, etc. |
| Minimum Pitch Capability | It can handle BGA components with pitches as low as 0.2mm (and ball diameters as small as 0.14mm). |
| Board Size | Custom BGA PCB sizes are available based on your specific project requirements. |
| Component Sourcing Options | Flexible choices: Full Turnkey (SMTFAB sources all BGA Components), Partial Turnkey, or Kitted/Consigned. |
| Quality Testing Protocols | Strict inspection with X-ray (a must for BGA Assembly), Automated Optical Inspection (AOI), and Functional Testing. |
| BGA Assembly Rework | Full-service operations: Reballing, Pad/Track Repair, Site Modification, Damaged Pad Correction, Component Removal/Replacement. |
| SMT Parts Presentation | Processes components in many formats: Cut Tape, Partial/Full Reel, Tube, Tray; uses laser-cut stainless steel stencils. |
BGA Package Types
When designing your BGA Assembly, you will find several types of packages. Each provides different aspects for your BGA PCB layout. Knowing them will assist you in selecting appropriate BGA Components. Let us see some common types used for BGA PCB Assembly.
Plastic BGAs (PBGA)
These are standard BGA Components with a plastic laminate substrate. You’ll notice PBGAs are economical solutions for most applications. They are used extensively in typical BGA Assembly procedures. This category offers good reliability for general-purpose BGA PCB designs. Use PBGAs for balanced performance and cost.
Ceramic BGAs (CBGA)
Do you need excellent reliability, especially in harsh temperatures? Ceramic BGAs have a ceramic substrate for enhanced thermal performance. Their endurance in challenging environments will benefit you greatly. They are a main option for high-reliability BGA PCB Assembly. CBGAs tend to be used in aerospace or high-performance computing BGA PCB applications.
Tape BGAs (TBGA)
Looking for an excellent thermal and electrical performance in a thinner profile? Tape BGAs employ a flexible tape substrate. This provides improved signal integrity on your BGA PCB. You achieve benefits in high-speed applications with these BGA Components. They provide improved performance characteristics for specialized BGA Assembly.
Enhanced BGAs (EBGA)
Enhanced BGAs work best when thermal control is a top priority. These BGA Components usually have integrated heat spreaders or slugs. You enhance heat dissipation directly from the chip via the BGA Assembly, making them ideal for high-power BGA PCB designs. EBGA keeps your device cooler.
Metal BGAs (MBGA)
Metal BGAs are used for applications requiring ultimate strength and heat dissipation. Manufacturers build these packages using metal components, including heat sinks. You have better thermal conductivity and physical robustness. MBGAs are applied to demanding BGA PCB Assembly situations. They operate at peak functionality for high-demanding BGA Components.
Micro BGAs (µBGA)
Building very tiny devices? Micro BGAs provide the smallest possible footprint for BGA Components. You can stuff more functionality into a small BGA PCB. This type of BGA Assembly takes BGA miniaturization to a whole new level. Select Micro BGAs when space is your top priority in your BGA PCB Assembly.
Why Choose SMTFAB as Your BGA Assembly Supplier?
Choose SMTFAB’s proven expertise and full turnkey solutions for high-risk BGA Assembly projects. Quality, speed, and cost-effectiveness are assured even in complex BGA Components.
Extensive BGA Assembly Experience
We focus on key details necessary for successful production, especially with high-density interconnect (HDI) designs. Our careful DFM and DFA checks examine your layout and component choice to ensure the subtleties of properly positioning fine-pitch BGA components are handled before production. Take advantage of our experience to optimize your BGA PCB design for error-free and efficient BGA assembly.
Advanced In-House BGA Capabilities
Our large facility houses highly automated SMT lines optimized for precise BGA Assembly. Most significantly, we utilize advanced inspections like X-rays, which are essential in verifying solder joints under BGA components. This ensures high yields and reliability for your BGA PCB without the time delays of outsourcing.
Full Turnkey BGA Service
We do everything from sourcing special BGA components from reliable suppliers to the end of the BGA PCB Assembly. Our team effectively sources, inspects parts, and handles logistics. You receive quality components reliably mounted onto your BGA PCB without the inconvenience of having to manage inventory yourself.
Strict BGA Quality Assurance
Quality comes first in BGA Assembly. We conduct 100% AOI and obligatory X-ray checking to ensure that each connection of your BGA Components has no defects. Meeting IPC specifications confirms that your finished BGA PCB Assembly is most reliable.
IPC-A-610 Standard Adherence
We adhere to the IPC-A-610 standard rigidly in every BGA assembly process. It is the international standard used worldwide and specifies the industry standards of what is acceptable in electronic assemblies. It ensures your BGA components are soldered adequately on the BGA PCB. Complying with this standard gives you a high-quality and reliable end product. You receive boards produced to industry-approved standards.
Competitive BGA Pricing
Get affordable BGA Assembly with SMTFAB. We have No Minimum Order Quantity (MOQ) and usually give free stencils for your BGA PCB Assembly. Our factory’s lower costs and savings from buying many parts give you great value. You receive good prices even for detailed BGA Components and complex BGA PCB designs.
Prototype or Low-Volume
Do you require rapid prototypes of your BGA PCB layout? SMTFAB specializes in low-volume BGA Assembly. We know how important speed is when you need to confirm designs involving intricate BGA Components. For emergencies, you can use our 24-hour expedited service. Our prototype orders typically take 3-4 days. We will specify the actual lead time in your quote.
Global Support and Confidentiality
Rely on 24/7 technical and sales assistance for your BGA Assembly projects. We offer NDA options and export compliance to ensure the security of your sensitive BGA PCB designs and intellectual property.
Need Expert BGA Assembly?
Do you need professional BGA Assembly? Contact SMTFAB today. Send us your project files, and we will provide you with a free, no-obligation quote for your specific BGA Assembly requirements.
Related Products
Get an Instant Online Quote Today
Do you need a BGA Assembly expert and trusted provider? SMTFAB offers excellent BGA PCB Assembly services, leveraging extensive experience in dealing with those intricate components in a precise way. Our enterprise provides professional assembly for your BGA PCB schematics, guaranteeing precise and high-quality boards through our capable process. Let SMTFAB start working on your BGA Assembly project for your free quote now!
Frequently Asked Questions
A BGA (Ball Grid Array) is an integrated circuit surface-mount package. Rather than pins, it features an array of solder balls on its bottom for contacts, providing more density on your BGA PCB.
The standard types of BGA Components are: PBGA (Plastic Ball Grid Array), CBGA (Ceramic Ball Grid Array), and TBGA (Tape Ball Grid Array), each suitable for differing application demands.
You would want to use BGA Components if your product needs high pin counts in a small space, such as microprocessors, FPGAs, ASICs, chipsets, or high-speed memory, where performance and space are paramount on the BGA PCB.
Although typical pitch sizes for BGA Components are between 0.5mm and 1.0mm, SMTFAB’s state-of-the-art BGA Assembly competencies enable us to work with much smaller pitches. We can consistently work with BGA Components with pitches as low as 0.2mm and single solder ball diameters of 0.14mm. This enables assembly of very high-density and intricate BGA packages.
BGA Assembly
Your Leading BGA Assembly Manufacturer in China
- Advanced BGA Capability: Specialized SMT lines are designed for accurate BGA assembly, processing sophisticated BGA PCB designs in high quantities.
- Full BGA Service: A one-stop-shop BGA PCB Assembly service that includes necessary DFM/DFA checkup for BGA Components, purchase, and complete project assistance.
- Certified BGA Quality: We guarantee BGA Assembly quality via ISO certifications and critical inspection techniques such as X-ray and AOI for accurate BGA PCB results.
Do you need more connections in a compact printed circuit board area? BGA Components provide a strong solution for contemporary electronics. Learn about BGA Assembly, an important process for installing these advanced components. Understand how SMTFAB BGA PCB Assembly Service can deliver your project better results.
What is Ball Grid Array (BGA) Assembly?
What is a BGA Assembly’s basic function? The advanced process uses specialized methods to place complex integrated circuits on circuit boards. These particular chips, known as BGA Components, differ from regular parts by having solder balls on their bottom surface. The bottom side of these arrays shows multiple tiny solder balls. The ball grid array design helps make BGA technology more helpful.
Through BGA PCB Assembly, we place the electronic parts exactly where they need to be on the PCB. Solder joint connections form perfectly during reflow soldering. The board enters a special oven where solder balls align uniformly. As the solder balls cool down, they become firm electrical links between the chip and the PCB board. Special X-ray scans must verify every joint type under the surface. This method allows today’s small electronic devices to contain more performance features than earlier technology setups.
What are the Advantages of a BGA Assembly?
Improved Performance & Space Efficiency
The direct chip connections and placement underneath the board boost BGA PCB signal speed and thermal performance while freeing up more space.
Reduced Board Thickness
Using BGA technology lets engineers reduce product size because circuits stay close to the board instead of extending through long wire leads.
Enhanced Durability
You reduce the chances of accidental lead damage when handling or operating, since the strong solder balls employed for BGA Components are much more durable than conventional leads, resulting in fewer repairs.
High Connection Density
This technology is ideal when connecting tiny packages with a very high pin count, since BGA PCB Assembly supports many more input/output connections in a smaller area.
Better Solderability & Faster Assembly
Because BGA Components stay centered during reflow soldering, they create regular solder joints faster, resulting in streamlined BGA PCB Assembly processing.
Efficient Heat Dissipation
You enjoy better thermal performance since the low thermal resistance path formed by the solder balls enables heat to be transferred efficiently from the BGA Components directly into the BGA PCB.
BGA Assembly Process
Carrying out a successful BGA PCB Assembly requires some important steps. We follow this exact process to produce dependable output. This guarantees your BGA Components work flawlessly on the BGA PCB. Look at how this procedure happens step by step.
- PCB Preparation
We start by preparing your BGA PCB with accurate amounts of solder paste. This paste is applied to the pads where the BGA Components will reside.
- BGA Placement
We then place the BGA Components accurately on top of the solder paste positions. Specialized automated pick-and-place machines perform the exact task of BGA Assembly.
- Reflow Soldering
The ready BGA PCB proceeds into a dedicated reflow oven. Precise temperature warms up the solder paste and the solder balls, forming solid electrical bonds for the BGA Assembly.
- Cooling and Inspection
Once soldering is complete, the board is cooled to set the temperature of the joints. Most importantly, we examine the BGA PCB Assembly using techniques such as AOIs and X-rays to identify any defects that may be concealed.
- Secondary Processes
Lastly, as per your requirements, we undertake secondary operations. The team performs basic maintenance tasks such as cleaning the board, running tests for functionality, and applying conformal coatings on the assembly surface area of the BGA.
Applications of BGA Assembly
Automotive
Do you need more electronics functionalities in your car systems? BGA Assembly provides increased package density on the BGA PCB. The technique lets engineers combine advanced functions into their devices, particularly navigation systems. Automotive applications enjoy the efficiency and performance improvement provided by BGA PCB Assembly. It integrates more power into compact spaces.
Aerospace
Heat management plays an important role in your aerospace work. BGA Assembly creates a better heat management system that is needed for advanced aerospace technology. A BGA PCB’s superior heat management capacity is appropriate for dynamic environments. Aerospace depends on the strong thermal cycling endurance of quality BGA PCB Assembly. It guarantees reliability under harsh conditions.
Industrial Equipment
Thermal stability is necessary for your industrial parts. Industrial components benefit from the strong design of BGA Assembly. Without fear, you can apply BGA PCB designs in motor drives and control systems. The technology guarantees dependable operation where high heat stability is necessary. Trust BGA PCB Assembly for industrial uses.
Computer and Mobile Devices
Are you assembling small computers or mobile phones? BGA Assembly is ideal as it requires minimal space and has good heat dissipation. Low impedance optimizes performance in these units. Using BGA components on a BGA PCB directly helps achieve thinner, lighter portable designs. It provides the flexibility of today’s computing units.
SMTFAB BGA Assembly Capabilities
| Capability Area | Details / Supported Options |
| Supported BGA PCB Types | Including Plastic (PBGA), Ceramic (CBGA), Micro BGA (MBGA), Stacked, Lead/Leadless, CTBGA, CABGA, VFBGA, LGA, CSP, WLCSP, etc. |
| Minimum Pitch Capability | It can handle BGA components with pitches as low as 0.2mm (and ball diameters as small as 0.14mm). |
| Board Size | Custom BGA PCB sizes are available based on your specific project requirements. |
| Component Sourcing Options | Flexible choices: Full Turnkey (SMTFAB sources all BGA Components), Partial Turnkey, or Kitted/Consigned. |
| Quality Testing Protocols | Strict inspection with X-ray (a must for BGA Assembly), Automated Optical Inspection (AOI), and Functional Testing. |
| BGA Assembly Rework | Full-service operations: Reballing, Pad/Track Repair, Site Modification, Damaged Pad Correction, Component Removal/Replacement. |
| SMT Parts Presentation | Processes components in many formats: Cut Tape, Partial/Full Reel, Tube, Tray; uses laser-cut stainless steel stencils. |
BGA Package Types
When designing your BGA Assembly, you will find several types of packages. Each provides different aspects for your BGA PCB layout. Knowing them will assist you in selecting appropriate BGA Components. Let us see some common types used for BGA PCB Assembly.
Plastic BGAs (PBGA)
These are standard BGA Components with a plastic laminate substrate. You’ll notice PBGAs are economical solutions for most applications. They are used extensively in typical BGA Assembly procedures. This category offers good reliability for general-purpose BGA PCB designs. Use PBGAs for balanced performance and cost.
Ceramic BGAs (CBGA)
Do you need excellent reliability, especially in harsh temperatures? Ceramic BGAs have a ceramic substrate for enhanced thermal performance. Their endurance in challenging environments will benefit you greatly. They are a main option for high-reliability BGA PCB Assembly. CBGAs tend to be used in aerospace or high-performance computing BGA PCB applications.
Tape BGAs (TBGA)
Looking for an excellent thermal and electrical performance in a thinner profile? Tape BGAs employ a flexible tape substrate. This provides improved signal integrity on your BGA PCB. You achieve benefits in high-speed applications with these BGA Components. They provide improved performance characteristics for specialized BGA Assembly.
Enhanced BGAs (EBGA)
Enhanced BGAs work best when thermal control is a top priority. These BGA Components usually have integrated heat spreaders or slugs. You enhance heat dissipation directly from the chip via the BGA Assembly, making them ideal for high-power BGA PCB designs. EBGA keeps your device cooler.
Metal BGAs (MBGA)
Metal BGAs are used for applications requiring ultimate strength and heat dissipation. Manufacturers build these packages using metal components, including heat sinks. You have better thermal conductivity and physical robustness. MBGAs are applied to demanding BGA PCB Assembly situations. They operate at peak functionality for high-demanding BGA Components.
Micro BGAs (µBGA)
Building very tiny devices? Micro BGAs provide the smallest possible footprint for BGA Components. You can stuff more functionality into a small BGA PCB. This type of BGA Assembly takes BGA miniaturization to a whole new level. Select Micro BGAs when space is your top priority in your BGA PCB Assembly.
Why Choose SMTFAB as Your BGA Assembly Supplier?
Choose SMTFAB’s proven expertise and full turnkey solutions for high-risk BGA Assembly projects. Quality, speed, and cost-effectiveness are assured even in complex BGA Components.
Extensive BGA Assembly Experience
We focus on key details necessary for successful production, especially with high-density interconnect (HDI) designs. Our careful DFM and DFA checks examine your layout and component choice to ensure the subtleties of properly positioning fine-pitch BGA components are handled before production. Take advantage of our experience to optimize your BGA PCB design for error-free and efficient BGA assembly.
Advanced In-House BGA Capabilities
Our large facility houses highly automated SMT lines optimized for precise BGA Assembly. Most significantly, we utilize advanced inspections like X-rays, which are essential in verifying solder joints under BGA components. This ensures high yields and reliability for your BGA PCB without the time delays of outsourcing.
Full Turnkey BGA Service
We do everything from sourcing special BGA components from reliable suppliers to the end of the BGA PCB Assembly. Our team effectively sources, inspects parts, and handles logistics. You receive quality components reliably mounted onto your BGA PCB without the inconvenience of having to manage inventory yourself.
Strict BGA Quality Assurance
Quality comes first in BGA Assembly. We conduct 100% AOI and obligatory X-ray checking to ensure that each connection of your BGA Components has no defects. Meeting IPC specifications confirms that your finished BGA PCB Assembly is most reliable.
IPC-A-610 Standard Adherence
We adhere to the IPC-A-610 standard rigidly in every BGA assembly process. It is the international standard used worldwide and specifies the industry standards of what is acceptable in electronic assemblies. It ensures your BGA components are soldered adequately on the BGA PCB. Complying with this standard gives you a high-quality and reliable end product. You receive boards produced to industry-approved standards.
Competitive BGA Pricing
Get affordable BGA Assembly with SMTFAB. We have No Minimum Order Quantity (MOQ) and usually give free stencils for your BGA PCB Assembly. Our factory’s lower costs and savings from buying many parts give you great value. You receive good prices even for detailed BGA Components and complex BGA PCB designs.
Prototype or Low-Volume
Do you require rapid prototypes of your BGA PCB layout? SMTFAB specializes in low-volume BGA Assembly. We know how important speed is when you need to confirm designs involving intricate BGA Components. For emergencies, you can use our 24-hour expedited service. Our prototype orders typically take 3-4 days. We will specify the actual lead time in your quote.
Global Support and Confidentiality
Rely on 24/7 technical and sales assistance for your BGA Assembly projects. We offer NDA options and export compliance to ensure the security of your sensitive BGA PCB designs and intellectual property.
Need Expert BGA Assembly?
Do you need professional BGA Assembly? Contact SMTFAB today. Send us your project files, and we will provide you with a free, no-obligation quote for your specific BGA Assembly requirements.
Related Products
Get an Instant Online Quote Today
Do you need a BGA Assembly expert and trusted provider? SMTFAB offers excellent BGA PCB Assembly services, leveraging extensive experience in dealing with those intricate components in a precise way. Our enterprise provides professional assembly for your BGA PCB schematics, guaranteeing precise and high-quality boards through our capable process. Let SMTFAB start working on your BGA Assembly project for your free quote now!
Frequently Asked Questions
A BGA (Ball Grid Array) is an integrated circuit surface-mount package. Rather than pins, it features an array of solder balls on its bottom for contacts, providing more density on your BGA PCB.
The standard types of BGA Components are: PBGA (Plastic Ball Grid Array), CBGA (Ceramic Ball Grid Array), and TBGA (Tape Ball Grid Array), each suitable for differing application demands.
You would want to use BGA Components if your product needs high pin counts in a small space, such as microprocessors, FPGAs, ASICs, chipsets, or high-speed memory, where performance and space are paramount on the BGA PCB.
Although typical pitch sizes for BGA Components are between 0.5mm and 1.0mm, SMTFAB’s state-of-the-art BGA Assembly competencies enable us to work with much smaller pitches. We can consistently work with BGA Components with pitches as low as 0.2mm and single solder ball diameters of 0.14mm. This enables assembly of very high-density and intricate BGA packages.
Your Leading BGA Assembly Manufacturer in China
- Advanced BGA Capability: Specialized SMT lines are designed for accurate BGA assembly, processing sophisticated BGA PCB designs in high quantities.
- Full BGA Service: A one-stop-shop BGA PCB Assembly service that includes necessary DFM/DFA checkup for BGA Components, purchase, and complete project assistance.
- Certified BGA Quality: We guarantee BGA Assembly quality via ISO certifications and critical inspection techniques such as X-ray and AOI for accurate BGA PCB results.
Do you need more connections in a compact printed circuit board area? BGA Components provide a strong solution for contemporary electronics. Learn about BGA Assembly, an important process for installing these advanced components. Understand how SMTFAB BGA PCB Assembly Service can deliver your project better results.
Your Leading BGA Assembly Manufacturer in China
- Advanced BGA Capability: Specialized SMT lines are designed for accurate BGA assembly, processing sophisticated BGA PCB designs in high quantities.
- Full BGA Service: A one-stop-shop BGA PCB Assembly service that includes necessary DFM/DFA checkup for BGA Components, purchase, and complete project assistance.
- Certified BGA Quality: We guarantee BGA Assembly quality via ISO certifications and critical inspection techniques such as X-ray and AOI for accurate BGA PCB results.
Do you need more connections in a compact printed circuit board area? BGA Components provide a strong solution for contemporary electronics. Learn about BGA Assembly, an important process for installing these advanced components. Understand how SMTFAB BGA PCB Assembly Service can deliver your project better results.
Your Leading BGA Assembly Manufacturer in China
- Advanced BGA Capability: Specialized SMT lines are designed for accurate BGA assembly, processing sophisticated BGA PCB designs in high quantities.
- Full BGA Service: A one-stop-shop BGA PCB Assembly service that includes necessary DFM/DFA checkup for BGA Components, purchase, and complete project assistance.
- Certified BGA Quality: We guarantee BGA Assembly quality via ISO certifications and critical inspection techniques such as X-ray and AOI for accurate BGA PCB results.
Do you need more connections in a compact printed circuit board area? BGA Components provide a strong solution for contemporary electronics. Learn about BGA Assembly, an important process for installing these advanced components. Understand how SMTFAB BGA PCB Assembly Service can deliver your project better results.
Your Leading BGA Assembly Manufacturer in China
- Advanced BGA Capability: Specialized SMT lines are designed for accurate BGA assembly, processing sophisticated BGA PCB designs in high quantities.
- Full BGA Service: A one-stop-shop BGA PCB Assembly service that includes necessary DFM/DFA checkup for BGA Components, purchase, and complete project assistance.
- Certified BGA Quality: We guarantee BGA Assembly quality via ISO certifications and critical inspection techniques such as X-ray and AOI for accurate BGA PCB results.
Do you need more connections in a compact printed circuit board area? BGA Components provide a strong solution for contemporary electronics. Learn about BGA Assembly, an important process for installing these advanced components. Understand how SMTFAB BGA PCB Assembly Service can deliver your project better results.
Your Leading BGA Assembly Manufacturer in China
- Advanced BGA Capability: Specialized SMT lines are designed for accurate BGA assembly, processing sophisticated BGA PCB designs in high quantities.
- Full BGA Service: A one-stop-shop BGA PCB Assembly service that includes necessary DFM/DFA checkup for BGA Components, purchase, and complete project assistance.
- Certified BGA Quality: We guarantee BGA Assembly quality via ISO certifications and critical inspection techniques such as X-ray and AOI for accurate BGA PCB results.
Your Leading BGA Assembly Manufacturer in China
- Advanced BGA Capability: Specialized SMT lines are designed for accurate BGA assembly, processing sophisticated BGA PCB designs in high quantities.
- Full BGA Service: A one-stop-shop BGA PCB Assembly service that includes necessary DFM/DFA checkup for BGA Components, purchase, and complete project assistance.
- Certified BGA Quality: We guarantee BGA Assembly quality via ISO certifications and critical inspection techniques such as X-ray and AOI for accurate BGA PCB results.
- Advanced BGA Capability: Specialized SMT lines are designed for accurate BGA assembly, processing sophisticated BGA PCB designs in high quantities.
- Full BGA Service: A one-stop-shop BGA PCB Assembly service that includes necessary DFM/DFA checkup for BGA Components, purchase, and complete project assistance.
- Certified BGA Quality: We guarantee BGA Assembly quality via ISO certifications and critical inspection techniques such as X-ray and AOI for accurate BGA PCB results.
Do you need more connections in a compact printed circuit board area? BGA Components provide a strong solution for contemporary electronics. Learn about BGA Assembly, an important process for installing these advanced components. Understand how SMTFAB BGA PCB Assembly Service can deliver your project better results.
Do you need more connections in a compact printed circuit board area? BGA Components provide a strong solution for contemporary electronics. Learn about BGA Assembly, an important process for installing these advanced components. Understand how SMTFAB BGA PCB Assembly Service can deliver your project better results.
What is Ball Grid Array (BGA) Assembly?
What is a BGA Assembly’s basic function? The advanced process uses specialized methods to place complex integrated circuits on circuit boards. These particular chips, known as BGA Components, differ from regular parts by having solder balls on their bottom surface. The bottom side of these arrays shows multiple tiny solder balls. The ball grid array design helps make BGA technology more helpful.
Through BGA PCB Assembly, we place the electronic parts exactly where they need to be on the PCB. Solder joint connections form perfectly during reflow soldering. The board enters a special oven where solder balls align uniformly. As the solder balls cool down, they become firm electrical links between the chip and the PCB board. Special X-ray scans must verify every joint type under the surface. This method allows today’s small electronic devices to contain more performance features than earlier technology setups.
What is Ball Grid Array (BGA) Assembly?
What is a BGA Assembly’s basic function? The advanced process uses specialized methods to place complex integrated circuits on circuit boards. These particular chips, known as BGA Components, differ from regular parts by having solder balls on their bottom surface. The bottom side of these arrays shows multiple tiny solder balls. The ball grid array design helps make BGA technology more helpful.
Through BGA PCB Assembly, we place the electronic parts exactly where they need to be on the PCB. Solder joint connections form perfectly during reflow soldering. The board enters a special oven where solder balls align uniformly. As the solder balls cool down, they become firm electrical links between the chip and the PCB board. Special X-ray scans must verify every joint type under the surface. This method allows today’s small electronic devices to contain more performance features than earlier technology setups.
What is Ball Grid Array (BGA) Assembly?
What is a BGA Assembly’s basic function? The advanced process uses specialized methods to place complex integrated circuits on circuit boards. These particular chips, known as BGA Components, differ from regular parts by having solder balls on their bottom surface. The bottom side of these arrays shows multiple tiny solder balls. The ball grid array design helps make BGA technology more helpful.
Through BGA PCB Assembly, we place the electronic parts exactly where they need to be on the PCB. Solder joint connections form perfectly during reflow soldering. The board enters a special oven where solder balls align uniformly. As the solder balls cool down, they become firm electrical links between the chip and the PCB board. Special X-ray scans must verify every joint type under the surface. This method allows today’s small electronic devices to contain more performance features than earlier technology setups.
What is Ball Grid Array (BGA) Assembly?
What is a BGA Assembly’s basic function? The advanced process uses specialized methods to place complex integrated circuits on circuit boards. These particular chips, known as BGA Components, differ from regular parts by having solder balls on their bottom surface. The bottom side of these arrays shows multiple tiny solder balls. The ball grid array design helps make BGA technology more helpful.
Through BGA PCB Assembly, we place the electronic parts exactly where they need to be on the PCB. Solder joint connections form perfectly during reflow soldering. The board enters a special oven where solder balls align uniformly. As the solder balls cool down, they become firm electrical links between the chip and the PCB board. Special X-ray scans must verify every joint type under the surface. This method allows today’s small electronic devices to contain more performance features than earlier technology setups.
What is Ball Grid Array (BGA) Assembly?
What is a BGA Assembly’s basic function? The advanced process uses specialized methods to place complex integrated circuits on circuit boards. These particular chips, known as BGA Components, differ from regular parts by having solder balls on their bottom surface. The bottom side of these arrays shows multiple tiny solder balls. The ball grid array design helps make BGA technology more helpful.
Through BGA PCB Assembly, we place the electronic parts exactly where they need to be on the PCB. Solder joint connections form perfectly during reflow soldering. The board enters a special oven where solder balls align uniformly. As the solder balls cool down, they become firm electrical links between the chip and the PCB board. Special X-ray scans must verify every joint type under the surface. This method allows today’s small electronic devices to contain more performance features than earlier technology setups.
What is a BGA Assembly’s basic function? The advanced process uses specialized methods to place complex integrated circuits on circuit boards. These particular chips, known as BGA Components, differ from regular parts by having solder balls on their bottom surface. The bottom side of these arrays shows multiple tiny solder balls. The ball grid array design helps make BGA technology more helpful.
Through BGA PCB Assembly, we place the electronic parts exactly where they need to be on the PCB. Solder joint connections form perfectly during reflow soldering. The board enters a special oven where solder balls align uniformly. As the solder balls cool down, they become firm electrical links between the chip and the PCB board. Special X-ray scans must verify every joint type under the surface. This method allows today’s small electronic devices to contain more performance features than earlier technology setups.
What are the Advantages of a BGA Assembly?
Improved Performance & Space Efficiency
The direct chip connections and placement underneath the board boost BGA PCB signal speed and thermal performance while freeing up more space.
Reduced Board Thickness
Using BGA technology lets engineers reduce product size because circuits stay close to the board instead of extending through long wire leads.
Enhanced Durability
You reduce the chances of accidental lead damage when handling or operating, since the strong solder balls employed for BGA Components are much more durable than conventional leads, resulting in fewer repairs.
High Connection Density
This technology is ideal when connecting tiny packages with a very high pin count, since BGA PCB Assembly supports many more input/output connections in a smaller area.
Better Solderability & Faster Assembly
Because BGA Components stay centered during reflow soldering, they create regular solder joints faster, resulting in streamlined BGA PCB Assembly processing.
Efficient Heat Dissipation
You enjoy better thermal performance since the low thermal resistance path formed by the solder balls enables heat to be transferred efficiently from the BGA Components directly into the BGA PCB.
What are the Advantages of a BGA Assembly?
Improved Performance & Space Efficiency
The direct chip connections and placement underneath the board boost BGA PCB signal speed and thermal performance while freeing up more space.
Reduced Board Thickness
Using BGA technology lets engineers reduce product size because circuits stay close to the board instead of extending through long wire leads.
Enhanced Durability
You reduce the chances of accidental lead damage when handling or operating, since the strong solder balls employed for BGA Components are much more durable than conventional leads, resulting in fewer repairs.
High Connection Density
This technology is ideal when connecting tiny packages with a very high pin count, since BGA PCB Assembly supports many more input/output connections in a smaller area.
Better Solderability & Faster Assembly
Because BGA Components stay centered during reflow soldering, they create regular solder joints faster, resulting in streamlined BGA PCB Assembly processing.
Efficient Heat Dissipation
You enjoy better thermal performance since the low thermal resistance path formed by the solder balls enables heat to be transferred efficiently from the BGA Components directly into the BGA PCB.
What are the Advantages of a BGA Assembly?
Improved Performance & Space Efficiency
The direct chip connections and placement underneath the board boost BGA PCB signal speed and thermal performance while freeing up more space.
Reduced Board Thickness
Using BGA technology lets engineers reduce product size because circuits stay close to the board instead of extending through long wire leads.
Enhanced Durability
You reduce the chances of accidental lead damage when handling or operating, since the strong solder balls employed for BGA Components are much more durable than conventional leads, resulting in fewer repairs.
High Connection Density
This technology is ideal when connecting tiny packages with a very high pin count, since BGA PCB Assembly supports many more input/output connections in a smaller area.
Better Solderability & Faster Assembly
Because BGA Components stay centered during reflow soldering, they create regular solder joints faster, resulting in streamlined BGA PCB Assembly processing.
Efficient Heat Dissipation
You enjoy better thermal performance since the low thermal resistance path formed by the solder balls enables heat to be transferred efficiently from the BGA Components directly into the BGA PCB.
What are the Advantages of a BGA Assembly?
Improved Performance & Space Efficiency
The direct chip connections and placement underneath the board boost BGA PCB signal speed and thermal performance while freeing up more space.
Reduced Board Thickness
Using BGA technology lets engineers reduce product size because circuits stay close to the board instead of extending through long wire leads.
Enhanced Durability
You reduce the chances of accidental lead damage when handling or operating, since the strong solder balls employed for BGA Components are much more durable than conventional leads, resulting in fewer repairs.
High Connection Density
This technology is ideal when connecting tiny packages with a very high pin count, since BGA PCB Assembly supports many more input/output connections in a smaller area.
Better Solderability & Faster Assembly
Because BGA Components stay centered during reflow soldering, they create regular solder joints faster, resulting in streamlined BGA PCB Assembly processing.
Efficient Heat Dissipation
You enjoy better thermal performance since the low thermal resistance path formed by the solder balls enables heat to be transferred efficiently from the BGA Components directly into the BGA PCB.
What are the Advantages of a BGA Assembly?
Improved Performance & Space Efficiency
The direct chip connections and placement underneath the board boost BGA PCB signal speed and thermal performance while freeing up more space.
Reduced Board Thickness
Using BGA technology lets engineers reduce product size because circuits stay close to the board instead of extending through long wire leads.
Enhanced Durability
You reduce the chances of accidental lead damage when handling or operating, since the strong solder balls employed for BGA Components are much more durable than conventional leads, resulting in fewer repairs.
High Connection Density
This technology is ideal when connecting tiny packages with a very high pin count, since BGA PCB Assembly supports many more input/output connections in a smaller area.
Better Solderability & Faster Assembly
Because BGA Components stay centered during reflow soldering, they create regular solder joints faster, resulting in streamlined BGA PCB Assembly processing.
Efficient Heat Dissipation
You enjoy better thermal performance since the low thermal resistance path formed by the solder balls enables heat to be transferred efficiently from the BGA Components directly into the BGA PCB.
Improved Performance & Space Efficiency
The direct chip connections and placement underneath the board boost BGA PCB signal speed and thermal performance while freeing up more space.
Reduced Board Thickness
Using BGA technology lets engineers reduce product size because circuits stay close to the board instead of extending through long wire leads.
You reduce the chances of accidental lead damage when handling or operating, since the strong solder balls employed for BGA Components are much more durable than conventional leads, resulting in fewer repairs.
High Connection Density
This technology is ideal when connecting tiny packages with a very high pin count, since BGA PCB Assembly supports many more input/output connections in a smaller area.
Better Solderability & Faster Assembly
Because BGA Components stay centered during reflow soldering, they create regular solder joints faster, resulting in streamlined BGA PCB Assembly processing.
Efficient Heat Dissipation
You enjoy better thermal performance since the low thermal resistance path formed by the solder balls enables heat to be transferred efficiently from the BGA Components directly into the BGA PCB.
BGA Assembly Process
Carrying out a successful BGA PCB Assembly requires some important steps. We follow this exact process to produce dependable output. This guarantees your BGA Components work flawlessly on the BGA PCB. Look at how this procedure happens step by step.
- PCB Preparation
We start by preparing your BGA PCB with accurate amounts of solder paste. This paste is applied to the pads where the BGA Components will reside.
- BGA Placement
We then place the BGA Components accurately on top of the solder paste positions. Specialized automated pick-and-place machines perform the exact task of BGA Assembly.
- Reflow Soldering
The ready BGA PCB proceeds into a dedicated reflow oven. Precise temperature warms up the solder paste and the solder balls, forming solid electrical bonds for the BGA Assembly.
- Cooling and Inspection
Once soldering is complete, the board is cooled to set the temperature of the joints. Most importantly, we examine the BGA PCB Assembly using techniques such as AOIs and X-rays to identify any defects that may be concealed.
- Secondary Processes
Lastly, as per your requirements, we undertake secondary operations. The team performs basic maintenance tasks such as cleaning the board, running tests for functionality, and applying conformal coatings on the assembly surface area of the BGA.
BGA Assembly Process
Carrying out a successful BGA PCB Assembly requires some important steps. We follow this exact process to produce dependable output. This guarantees your BGA Components work flawlessly on the BGA PCB. Look at how this procedure happens step by step.
- PCB Preparation
We start by preparing your BGA PCB with accurate amounts of solder paste. This paste is applied to the pads where the BGA Components will reside.
- BGA Placement
We then place the BGA Components accurately on top of the solder paste positions. Specialized automated pick-and-place machines perform the exact task of BGA Assembly.
- Reflow Soldering
The ready BGA PCB proceeds into a dedicated reflow oven. Precise temperature warms up the solder paste and the solder balls, forming solid electrical bonds for the BGA Assembly.
- Cooling and Inspection
Once soldering is complete, the board is cooled to set the temperature of the joints. Most importantly, we examine the BGA PCB Assembly using techniques such as AOIs and X-rays to identify any defects that may be concealed.
- Secondary Processes
Lastly, as per your requirements, we undertake secondary operations. The team performs basic maintenance tasks such as cleaning the board, running tests for functionality, and applying conformal coatings on the assembly surface area of the BGA.
BGA Assembly Process
Carrying out a successful BGA PCB Assembly requires some important steps. We follow this exact process to produce dependable output. This guarantees your BGA Components work flawlessly on the BGA PCB. Look at how this procedure happens step by step.
- PCB Preparation
We start by preparing your BGA PCB with accurate amounts of solder paste. This paste is applied to the pads where the BGA Components will reside.
- BGA Placement
We then place the BGA Components accurately on top of the solder paste positions. Specialized automated pick-and-place machines perform the exact task of BGA Assembly.
- Reflow Soldering
The ready BGA PCB proceeds into a dedicated reflow oven. Precise temperature warms up the solder paste and the solder balls, forming solid electrical bonds for the BGA Assembly.
- Cooling and Inspection
Once soldering is complete, the board is cooled to set the temperature of the joints. Most importantly, we examine the BGA PCB Assembly using techniques such as AOIs and X-rays to identify any defects that may be concealed.
- Secondary Processes
Lastly, as per your requirements, we undertake secondary operations. The team performs basic maintenance tasks such as cleaning the board, running tests for functionality, and applying conformal coatings on the assembly surface area of the BGA.
BGA Assembly Process
Carrying out a successful BGA PCB Assembly requires some important steps. We follow this exact process to produce dependable output. This guarantees your BGA Components work flawlessly on the BGA PCB. Look at how this procedure happens step by step.
- PCB Preparation
We start by preparing your BGA PCB with accurate amounts of solder paste. This paste is applied to the pads where the BGA Components will reside.
- BGA Placement
We then place the BGA Components accurately on top of the solder paste positions. Specialized automated pick-and-place machines perform the exact task of BGA Assembly.
- Reflow Soldering
The ready BGA PCB proceeds into a dedicated reflow oven. Precise temperature warms up the solder paste and the solder balls, forming solid electrical bonds for the BGA Assembly.
- Cooling and Inspection
Once soldering is complete, the board is cooled to set the temperature of the joints. Most importantly, we examine the BGA PCB Assembly using techniques such as AOIs and X-rays to identify any defects that may be concealed.
- Secondary Processes
Lastly, as per your requirements, we undertake secondary operations. The team performs basic maintenance tasks such as cleaning the board, running tests for functionality, and applying conformal coatings on the assembly surface area of the BGA.
Carrying out a successful BGA PCB Assembly requires some important steps. We follow this exact process to produce dependable output. This guarantees your BGA Components work flawlessly on the BGA PCB. Look at how this procedure happens step by step.
- PCB Preparation
We start by preparing your BGA PCB with accurate amounts of solder paste. This paste is applied to the pads where the BGA Components will reside.
- BGA Placement
We then place the BGA Components accurately on top of the solder paste positions. Specialized automated pick-and-place machines perform the exact task of BGA Assembly.
- Reflow Soldering
The ready BGA PCB proceeds into a dedicated reflow oven. Precise temperature warms up the solder paste and the solder balls, forming solid electrical bonds for the BGA Assembly.
- Cooling and Inspection
Once soldering is complete, the board is cooled to set the temperature of the joints. Most importantly, we examine the BGA PCB Assembly using techniques such as AOIs and X-rays to identify any defects that may be concealed.
- Secondary Processes
Lastly, as per your requirements, we undertake secondary operations. The team performs basic maintenance tasks such as cleaning the board, running tests for functionality, and applying conformal coatings on the assembly surface area of the BGA.
Carrying out a successful BGA PCB Assembly requires some important steps. We follow this exact process to produce dependable output. This guarantees your BGA Components work flawlessly on the BGA PCB. Look at how this procedure happens step by step.
We start by preparing your BGA PCB with accurate amounts of solder paste. This paste is applied to the pads where the BGA Components will reside.
We then place the BGA Components accurately on top of the solder paste positions. Specialized automated pick-and-place machines perform the exact task of BGA Assembly.
The ready BGA PCB proceeds into a dedicated reflow oven. Precise temperature warms up the solder paste and the solder balls, forming solid electrical bonds for the BGA Assembly.
- Cooling and Inspection
Once soldering is complete, the board is cooled to set the temperature of the joints. Most importantly, we examine the BGA PCB Assembly using techniques such as AOIs and X-rays to identify any defects that may be concealed.
Lastly, as per your requirements, we undertake secondary operations. The team performs basic maintenance tasks such as cleaning the board, running tests for functionality, and applying conformal coatings on the assembly surface area of the BGA.
Applications of BGA Assembly
Automotive
Do you need more electronics functionalities in your car systems? BGA Assembly provides increased package density on the BGA PCB. The technique lets engineers combine advanced functions into their devices, particularly navigation systems. Automotive applications enjoy the efficiency and performance improvement provided by BGA PCB Assembly. It integrates more power into compact spaces.
Aerospace
Heat management plays an important role in your aerospace work. BGA Assembly creates a better heat management system that is needed for advanced aerospace technology. A BGA PCB’s superior heat management capacity is appropriate for dynamic environments. Aerospace depends on the strong thermal cycling endurance of quality BGA PCB Assembly. It guarantees reliability under harsh conditions.
Industrial Equipment
Thermal stability is necessary for your industrial parts. Industrial components benefit from the strong design of BGA Assembly. Without fear, you can apply BGA PCB designs in motor drives and control systems. The technology guarantees dependable operation where high heat stability is necessary. Trust BGA PCB Assembly for industrial uses.
Computer and Mobile Devices
Are you assembling small computers or mobile phones? BGA Assembly is ideal as it requires minimal space and has good heat dissipation. Low impedance optimizes performance in these units. Using BGA components on a BGA PCB directly helps achieve thinner, lighter portable designs. It provides the flexibility of today’s computing units.
Applications of BGA Assembly
Automotive
Do you need more electronics functionalities in your car systems? BGA Assembly provides increased package density on the BGA PCB. The technique lets engineers combine advanced functions into their devices, particularly navigation systems. Automotive applications enjoy the efficiency and performance improvement provided by BGA PCB Assembly. It integrates more power into compact spaces.
Aerospace
Heat management plays an important role in your aerospace work. BGA Assembly creates a better heat management system that is needed for advanced aerospace technology. A BGA PCB’s superior heat management capacity is appropriate for dynamic environments. Aerospace depends on the strong thermal cycling endurance of quality BGA PCB Assembly. It guarantees reliability under harsh conditions.
Industrial Equipment
Thermal stability is necessary for your industrial parts. Industrial components benefit from the strong design of BGA Assembly. Without fear, you can apply BGA PCB designs in motor drives and control systems. The technology guarantees dependable operation where high heat stability is necessary. Trust BGA PCB Assembly for industrial uses.
Computer and Mobile Devices
Are you assembling small computers or mobile phones? BGA Assembly is ideal as it requires minimal space and has good heat dissipation. Low impedance optimizes performance in these units. Using BGA components on a BGA PCB directly helps achieve thinner, lighter portable designs. It provides the flexibility of today’s computing units.
Applications of BGA Assembly
Automotive
Do you need more electronics functionalities in your car systems? BGA Assembly provides increased package density on the BGA PCB. The technique lets engineers combine advanced functions into their devices, particularly navigation systems. Automotive applications enjoy the efficiency and performance improvement provided by BGA PCB Assembly. It integrates more power into compact spaces.
Aerospace
Heat management plays an important role in your aerospace work. BGA Assembly creates a better heat management system that is needed for advanced aerospace technology. A BGA PCB’s superior heat management capacity is appropriate for dynamic environments. Aerospace depends on the strong thermal cycling endurance of quality BGA PCB Assembly. It guarantees reliability under harsh conditions.
Industrial Equipment
Thermal stability is necessary for your industrial parts. Industrial components benefit from the strong design of BGA Assembly. Without fear, you can apply BGA PCB designs in motor drives and control systems. The technology guarantees dependable operation where high heat stability is necessary. Trust BGA PCB Assembly for industrial uses.
Computer and Mobile Devices
Are you assembling small computers or mobile phones? BGA Assembly is ideal as it requires minimal space and has good heat dissipation. Low impedance optimizes performance in these units. Using BGA components on a BGA PCB directly helps achieve thinner, lighter portable designs. It provides the flexibility of today’s computing units.
Applications of BGA Assembly
Automotive
Do you need more electronics functionalities in your car systems? BGA Assembly provides increased package density on the BGA PCB. The technique lets engineers combine advanced functions into their devices, particularly navigation systems. Automotive applications enjoy the efficiency and performance improvement provided by BGA PCB Assembly. It integrates more power into compact spaces.
Aerospace
Heat management plays an important role in your aerospace work. BGA Assembly creates a better heat management system that is needed for advanced aerospace technology. A BGA PCB’s superior heat management capacity is appropriate for dynamic environments. Aerospace depends on the strong thermal cycling endurance of quality BGA PCB Assembly. It guarantees reliability under harsh conditions.
Industrial Equipment
Thermal stability is necessary for your industrial parts. Industrial components benefit from the strong design of BGA Assembly. Without fear, you can apply BGA PCB designs in motor drives and control systems. The technology guarantees dependable operation where high heat stability is necessary. Trust BGA PCB Assembly for industrial uses.
Computer and Mobile Devices
Are you assembling small computers or mobile phones? BGA Assembly is ideal as it requires minimal space and has good heat dissipation. Low impedance optimizes performance in these units. Using BGA components on a BGA PCB directly helps achieve thinner, lighter portable designs. It provides the flexibility of today’s computing units.
Applications of BGA Assembly
Automotive
Do you need more electronics functionalities in your car systems? BGA Assembly provides increased package density on the BGA PCB. The technique lets engineers combine advanced functions into their devices, particularly navigation systems. Automotive applications enjoy the efficiency and performance improvement provided by BGA PCB Assembly. It integrates more power into compact spaces.
Aerospace
Heat management plays an important role in your aerospace work. BGA Assembly creates a better heat management system that is needed for advanced aerospace technology. A BGA PCB’s superior heat management capacity is appropriate for dynamic environments. Aerospace depends on the strong thermal cycling endurance of quality BGA PCB Assembly. It guarantees reliability under harsh conditions.
Industrial Equipment
Thermal stability is necessary for your industrial parts. Industrial components benefit from the strong design of BGA Assembly. Without fear, you can apply BGA PCB designs in motor drives and control systems. The technology guarantees dependable operation where high heat stability is necessary. Trust BGA PCB Assembly for industrial uses.
Computer and Mobile Devices
Are you assembling small computers or mobile phones? BGA Assembly is ideal as it requires minimal space and has good heat dissipation. Low impedance optimizes performance in these units. Using BGA components on a BGA PCB directly helps achieve thinner, lighter portable designs. It provides the flexibility of today’s computing units.
Do you need more electronics functionalities in your car systems? BGA Assembly provides increased package density on the BGA PCB. The technique lets engineers combine advanced functions into their devices, particularly navigation systems. Automotive applications enjoy the efficiency and performance improvement provided by BGA PCB Assembly. It integrates more power into compact spaces.
Heat management plays an important role in your aerospace work. BGA Assembly creates a better heat management system that is needed for advanced aerospace technology. A BGA PCB’s superior heat management capacity is appropriate for dynamic environments. Aerospace depends on the strong thermal cycling endurance of quality BGA PCB Assembly. It guarantees reliability under harsh conditions.
Thermal stability is necessary for your industrial parts. Industrial components benefit from the strong design of BGA Assembly. Without fear, you can apply BGA PCB designs in motor drives and control systems. The technology guarantees dependable operation where high heat stability is necessary. Trust BGA PCB Assembly for industrial uses.
Computer and Mobile Devices
Are you assembling small computers or mobile phones? BGA Assembly is ideal as it requires minimal space and has good heat dissipation. Low impedance optimizes performance in these units. Using BGA components on a BGA PCB directly helps achieve thinner, lighter portable designs. It provides the flexibility of today’s computing units.
SMTFAB BGA Assembly Capabilities
| Capability Area | Details / Supported Options |
| Supported BGA PCB Types | Including Plastic (PBGA), Ceramic (CBGA), Micro BGA (MBGA), Stacked, Lead/Leadless, CTBGA, CABGA, VFBGA, LGA, CSP, WLCSP, etc. |
| Minimum Pitch Capability | It can handle BGA components with pitches as low as 0.2mm (and ball diameters as small as 0.14mm). |
| Board Size | Custom BGA PCB sizes are available based on your specific project requirements. |
| Component Sourcing Options | Flexible choices: Full Turnkey (SMTFAB sources all BGA Components), Partial Turnkey, or Kitted/Consigned. |
| Quality Testing Protocols | Strict inspection with X-ray (a must for BGA Assembly), Automated Optical Inspection (AOI), and Functional Testing. |
| BGA Assembly Rework | Full-service operations: Reballing, Pad/Track Repair, Site Modification, Damaged Pad Correction, Component Removal/Replacement. |
| SMT Parts Presentation | Processes components in many formats: Cut Tape, Partial/Full Reel, Tube, Tray; uses laser-cut stainless steel stencils. |
SMTFAB BGA Assembly Capabilities
| Capability Area | Details / Supported Options |
| Supported BGA PCB Types | Including Plastic (PBGA), Ceramic (CBGA), Micro BGA (MBGA), Stacked, Lead/Leadless, CTBGA, CABGA, VFBGA, LGA, CSP, WLCSP, etc. |
| Minimum Pitch Capability | It can handle BGA components with pitches as low as 0.2mm (and ball diameters as small as 0.14mm). |
| Board Size | Custom BGA PCB sizes are available based on your specific project requirements. |
| Component Sourcing Options | Flexible choices: Full Turnkey (SMTFAB sources all BGA Components), Partial Turnkey, or Kitted/Consigned. |
| Quality Testing Protocols | Strict inspection with X-ray (a must for BGA Assembly), Automated Optical Inspection (AOI), and Functional Testing. |
| BGA Assembly Rework | Full-service operations: Reballing, Pad/Track Repair, Site Modification, Damaged Pad Correction, Component Removal/Replacement. |
| SMT Parts Presentation | Processes components in many formats: Cut Tape, Partial/Full Reel, Tube, Tray; uses laser-cut stainless steel stencils. |
SMTFAB BGA Assembly Capabilities
| Capability Area | Details / Supported Options |
| Supported BGA PCB Types | Including Plastic (PBGA), Ceramic (CBGA), Micro BGA (MBGA), Stacked, Lead/Leadless, CTBGA, CABGA, VFBGA, LGA, CSP, WLCSP, etc. |
| Minimum Pitch Capability | It can handle BGA components with pitches as low as 0.2mm (and ball diameters as small as 0.14mm). |
| Board Size | Custom BGA PCB sizes are available based on your specific project requirements. |
| Component Sourcing Options | Flexible choices: Full Turnkey (SMTFAB sources all BGA Components), Partial Turnkey, or Kitted/Consigned. |
| Quality Testing Protocols | Strict inspection with X-ray (a must for BGA Assembly), Automated Optical Inspection (AOI), and Functional Testing. |
| BGA Assembly Rework | Full-service operations: Reballing, Pad/Track Repair, Site Modification, Damaged Pad Correction, Component Removal/Replacement. |
| SMT Parts Presentation | Processes components in many formats: Cut Tape, Partial/Full Reel, Tube, Tray; uses laser-cut stainless steel stencils. |
SMTFAB BGA Assembly Capabilities
| Capability Area | Details / Supported Options |
| Supported BGA PCB Types | Including Plastic (PBGA), Ceramic (CBGA), Micro BGA (MBGA), Stacked, Lead/Leadless, CTBGA, CABGA, VFBGA, LGA, CSP, WLCSP, etc. |
| Minimum Pitch Capability | It can handle BGA components with pitches as low as 0.2mm (and ball diameters as small as 0.14mm). |
| Board Size | Custom BGA PCB sizes are available based on your specific project requirements. |
| Component Sourcing Options | Flexible choices: Full Turnkey (SMTFAB sources all BGA Components), Partial Turnkey, or Kitted/Consigned. |
| Quality Testing Protocols | Strict inspection with X-ray (a must for BGA Assembly), Automated Optical Inspection (AOI), and Functional Testing. |
| BGA Assembly Rework | Full-service operations: Reballing, Pad/Track Repair, Site Modification, Damaged Pad Correction, Component Removal/Replacement. |
| SMT Parts Presentation | Processes components in many formats: Cut Tape, Partial/Full Reel, Tube, Tray; uses laser-cut stainless steel stencils. |
SMTFAB BGA Assembly Capabilities
| Capability Area | Details / Supported Options |
| Supported BGA PCB Types | Including Plastic (PBGA), Ceramic (CBGA), Micro BGA (MBGA), Stacked, Lead/Leadless, CTBGA, CABGA, VFBGA, LGA, CSP, WLCSP, etc. |
| Minimum Pitch Capability | It can handle BGA components with pitches as low as 0.2mm (and ball diameters as small as 0.14mm). |
| Board Size | Custom BGA PCB sizes are available based on your specific project requirements. |
| Component Sourcing Options | Flexible choices: Full Turnkey (SMTFAB sources all BGA Components), Partial Turnkey, or Kitted/Consigned. |
| Quality Testing Protocols | Strict inspection with X-ray (a must for BGA Assembly), Automated Optical Inspection (AOI), and Functional Testing. |
| BGA Assembly Rework | Full-service operations: Reballing, Pad/Track Repair, Site Modification, Damaged Pad Correction, Component Removal/Replacement. |
| SMT Parts Presentation | Processes components in many formats: Cut Tape, Partial/Full Reel, Tube, Tray; uses laser-cut stainless steel stencils. |
| Capability Area | Details / Supported Options |
| Supported BGA PCB Types | Including Plastic (PBGA), Ceramic (CBGA), Micro BGA (MBGA), Stacked, Lead/Leadless, CTBGA, CABGA, VFBGA, LGA, CSP, WLCSP, etc. |
| Minimum Pitch Capability | It can handle BGA components with pitches as low as 0.2mm (and ball diameters as small as 0.14mm). |
| Board Size | Custom BGA PCB sizes are available based on your specific project requirements. |
| Component Sourcing Options | Flexible choices: Full Turnkey (SMTFAB sources all BGA Components), Partial Turnkey, or Kitted/Consigned. |
| Quality Testing Protocols | Strict inspection with X-ray (a must for BGA Assembly), Automated Optical Inspection (AOI), and Functional Testing. |
| BGA Assembly Rework | Full-service operations: Reballing, Pad/Track Repair, Site Modification, Damaged Pad Correction, Component Removal/Replacement. |
| SMT Parts Presentation | Processes components in many formats: Cut Tape, Partial/Full Reel, Tube, Tray; uses laser-cut stainless steel stencils. |
BGA Package Types
When designing your BGA Assembly, you will find several types of packages. Each provides different aspects for your BGA PCB layout. Knowing them will assist you in selecting appropriate BGA Components. Let us see some common types used for BGA PCB Assembly.
Plastic BGAs (PBGA)
These are standard BGA Components with a plastic laminate substrate. You’ll notice PBGAs are economical solutions for most applications. They are used extensively in typical BGA Assembly procedures. This category offers good reliability for general-purpose BGA PCB designs. Use PBGAs for balanced performance and cost.
Ceramic BGAs (CBGA)
Do you need excellent reliability, especially in harsh temperatures? Ceramic BGAs have a ceramic substrate for enhanced thermal performance. Their endurance in challenging environments will benefit you greatly. They are a main option for high-reliability BGA PCB Assembly. CBGAs tend to be used in aerospace or high-performance computing BGA PCB applications.
Tape BGAs (TBGA)
Looking for an excellent thermal and electrical performance in a thinner profile? Tape BGAs employ a flexible tape substrate. This provides improved signal integrity on your BGA PCB. You achieve benefits in high-speed applications with these BGA Components. They provide improved performance characteristics for specialized BGA Assembly.
Enhanced BGAs (EBGA)
Enhanced BGAs work best when thermal control is a top priority. These BGA Components usually have integrated heat spreaders or slugs. You enhance heat dissipation directly from the chip via the BGA Assembly, making them ideal for high-power BGA PCB designs. EBGA keeps your device cooler.
Metal BGAs (MBGA)
Metal BGAs are used for applications requiring ultimate strength and heat dissipation. Manufacturers build these packages using metal components, including heat sinks. You have better thermal conductivity and physical robustness. MBGAs are applied to demanding BGA PCB Assembly situations. They operate at peak functionality for high-demanding BGA Components.
Micro BGAs (µBGA)
Building very tiny devices? Micro BGAs provide the smallest possible footprint for BGA Components. You can stuff more functionality into a small BGA PCB. This type of BGA Assembly takes BGA miniaturization to a whole new level. Select Micro BGAs when space is your top priority in your BGA PCB Assembly.
BGA Package Types
When designing your BGA Assembly, you will find several types of packages. Each provides different aspects for your BGA PCB layout. Knowing them will assist you in selecting appropriate BGA Components. Let us see some common types used for BGA PCB Assembly.
Plastic BGAs (PBGA)
These are standard BGA Components with a plastic laminate substrate. You’ll notice PBGAs are economical solutions for most applications. They are used extensively in typical BGA Assembly procedures. This category offers good reliability for general-purpose BGA PCB designs. Use PBGAs for balanced performance and cost.
Ceramic BGAs (CBGA)
Do you need excellent reliability, especially in harsh temperatures? Ceramic BGAs have a ceramic substrate for enhanced thermal performance. Their endurance in challenging environments will benefit you greatly. They are a main option for high-reliability BGA PCB Assembly. CBGAs tend to be used in aerospace or high-performance computing BGA PCB applications.
Tape BGAs (TBGA)
Looking for an excellent thermal and electrical performance in a thinner profile? Tape BGAs employ a flexible tape substrate. This provides improved signal integrity on your BGA PCB. You achieve benefits in high-speed applications with these BGA Components. They provide improved performance characteristics for specialized BGA Assembly.
Enhanced BGAs (EBGA)
Enhanced BGAs work best when thermal control is a top priority. These BGA Components usually have integrated heat spreaders or slugs. You enhance heat dissipation directly from the chip via the BGA Assembly, making them ideal for high-power BGA PCB designs. EBGA keeps your device cooler.
Metal BGAs (MBGA)
Metal BGAs are used for applications requiring ultimate strength and heat dissipation. Manufacturers build these packages using metal components, including heat sinks. You have better thermal conductivity and physical robustness. MBGAs are applied to demanding BGA PCB Assembly situations. They operate at peak functionality for high-demanding BGA Components.
Micro BGAs (µBGA)
Building very tiny devices? Micro BGAs provide the smallest possible footprint for BGA Components. You can stuff more functionality into a small BGA PCB. This type of BGA Assembly takes BGA miniaturization to a whole new level. Select Micro BGAs when space is your top priority in your BGA PCB Assembly.
BGA Package Types
When designing your BGA Assembly, you will find several types of packages. Each provides different aspects for your BGA PCB layout. Knowing them will assist you in selecting appropriate BGA Components. Let us see some common types used for BGA PCB Assembly.
Plastic BGAs (PBGA)
These are standard BGA Components with a plastic laminate substrate. You’ll notice PBGAs are economical solutions for most applications. They are used extensively in typical BGA Assembly procedures. This category offers good reliability for general-purpose BGA PCB designs. Use PBGAs for balanced performance and cost.
Ceramic BGAs (CBGA)
Do you need excellent reliability, especially in harsh temperatures? Ceramic BGAs have a ceramic substrate for enhanced thermal performance. Their endurance in challenging environments will benefit you greatly. They are a main option for high-reliability BGA PCB Assembly. CBGAs tend to be used in aerospace or high-performance computing BGA PCB applications.
Tape BGAs (TBGA)
Looking for an excellent thermal and electrical performance in a thinner profile? Tape BGAs employ a flexible tape substrate. This provides improved signal integrity on your BGA PCB. You achieve benefits in high-speed applications with these BGA Components. They provide improved performance characteristics for specialized BGA Assembly.
Enhanced BGAs (EBGA)
Enhanced BGAs work best when thermal control is a top priority. These BGA Components usually have integrated heat spreaders or slugs. You enhance heat dissipation directly from the chip via the BGA Assembly, making them ideal for high-power BGA PCB designs. EBGA keeps your device cooler.
Metal BGAs (MBGA)
Metal BGAs are used for applications requiring ultimate strength and heat dissipation. Manufacturers build these packages using metal components, including heat sinks. You have better thermal conductivity and physical robustness. MBGAs are applied to demanding BGA PCB Assembly situations. They operate at peak functionality for high-demanding BGA Components.
Micro BGAs (µBGA)
Building very tiny devices? Micro BGAs provide the smallest possible footprint for BGA Components. You can stuff more functionality into a small BGA PCB. This type of BGA Assembly takes BGA miniaturization to a whole new level. Select Micro BGAs when space is your top priority in your BGA PCB Assembly.
BGA Package Types
When designing your BGA Assembly, you will find several types of packages. Each provides different aspects for your BGA PCB layout. Knowing them will assist you in selecting appropriate BGA Components. Let us see some common types used for BGA PCB Assembly.
Plastic BGAs (PBGA)
These are standard BGA Components with a plastic laminate substrate. You’ll notice PBGAs are economical solutions for most applications. They are used extensively in typical BGA Assembly procedures. This category offers good reliability for general-purpose BGA PCB designs. Use PBGAs for balanced performance and cost.
Ceramic BGAs (CBGA)
Do you need excellent reliability, especially in harsh temperatures? Ceramic BGAs have a ceramic substrate for enhanced thermal performance. Their endurance in challenging environments will benefit you greatly. They are a main option for high-reliability BGA PCB Assembly. CBGAs tend to be used in aerospace or high-performance computing BGA PCB applications.
Tape BGAs (TBGA)
Looking for an excellent thermal and electrical performance in a thinner profile? Tape BGAs employ a flexible tape substrate. This provides improved signal integrity on your BGA PCB. You achieve benefits in high-speed applications with these BGA Components. They provide improved performance characteristics for specialized BGA Assembly.
Enhanced BGAs (EBGA)
Enhanced BGAs work best when thermal control is a top priority. These BGA Components usually have integrated heat spreaders or slugs. You enhance heat dissipation directly from the chip via the BGA Assembly, making them ideal for high-power BGA PCB designs. EBGA keeps your device cooler.
Metal BGAs (MBGA)
Metal BGAs are used for applications requiring ultimate strength and heat dissipation. Manufacturers build these packages using metal components, including heat sinks. You have better thermal conductivity and physical robustness. MBGAs are applied to demanding BGA PCB Assembly situations. They operate at peak functionality for high-demanding BGA Components.
Micro BGAs (µBGA)
Building very tiny devices? Micro BGAs provide the smallest possible footprint for BGA Components. You can stuff more functionality into a small BGA PCB. This type of BGA Assembly takes BGA miniaturization to a whole new level. Select Micro BGAs when space is your top priority in your BGA PCB Assembly.
When designing your BGA Assembly, you will find several types of packages. Each provides different aspects for your BGA PCB layout. Knowing them will assist you in selecting appropriate BGA Components. Let us see some common types used for BGA PCB Assembly.
Plastic BGAs (PBGA)
These are standard BGA Components with a plastic laminate substrate. You’ll notice PBGAs are economical solutions for most applications. They are used extensively in typical BGA Assembly procedures. This category offers good reliability for general-purpose BGA PCB designs. Use PBGAs for balanced performance and cost.
Ceramic BGAs (CBGA)
Do you need excellent reliability, especially in harsh temperatures? Ceramic BGAs have a ceramic substrate for enhanced thermal performance. Their endurance in challenging environments will benefit you greatly. They are a main option for high-reliability BGA PCB Assembly. CBGAs tend to be used in aerospace or high-performance computing BGA PCB applications.
Tape BGAs (TBGA)
Looking for an excellent thermal and electrical performance in a thinner profile? Tape BGAs employ a flexible tape substrate. This provides improved signal integrity on your BGA PCB. You achieve benefits in high-speed applications with these BGA Components. They provide improved performance characteristics for specialized BGA Assembly.
Enhanced BGAs (EBGA)
Enhanced BGAs work best when thermal control is a top priority. These BGA Components usually have integrated heat spreaders or slugs. You enhance heat dissipation directly from the chip via the BGA Assembly, making them ideal for high-power BGA PCB designs. EBGA keeps your device cooler.
Metal BGAs (MBGA)
Metal BGAs are used for applications requiring ultimate strength and heat dissipation. Manufacturers build these packages using metal components, including heat sinks. You have better thermal conductivity and physical robustness. MBGAs are applied to demanding BGA PCB Assembly situations. They operate at peak functionality for high-demanding BGA Components.
Micro BGAs (µBGA)
Building very tiny devices? Micro BGAs provide the smallest possible footprint for BGA Components. You can stuff more functionality into a small BGA PCB. This type of BGA Assembly takes BGA miniaturization to a whole new level. Select Micro BGAs when space is your top priority in your BGA PCB Assembly.
When designing your BGA Assembly, you will find several types of packages. Each provides different aspects for your BGA PCB layout. Knowing them will assist you in selecting appropriate BGA Components. Let us see some common types used for BGA PCB Assembly.
These are standard BGA Components with a plastic laminate substrate. You’ll notice PBGAs are economical solutions for most applications. They are used extensively in typical BGA Assembly procedures. This category offers good reliability for general-purpose BGA PCB designs. Use PBGAs for balanced performance and cost.
Do you need excellent reliability, especially in harsh temperatures? Ceramic BGAs have a ceramic substrate for enhanced thermal performance. Their endurance in challenging environments will benefit you greatly. They are a main option for high-reliability BGA PCB Assembly. CBGAs tend to be used in aerospace or high-performance computing BGA PCB applications.
Looking for an excellent thermal and electrical performance in a thinner profile? Tape BGAs employ a flexible tape substrate. This provides improved signal integrity on your BGA PCB. You achieve benefits in high-speed applications with these BGA Components. They provide improved performance characteristics for specialized BGA Assembly.
Enhanced BGAs work best when thermal control is a top priority. These BGA Components usually have integrated heat spreaders or slugs. You enhance heat dissipation directly from the chip via the BGA Assembly, making them ideal for high-power BGA PCB designs. EBGA keeps your device cooler.
Metal BGAs are used for applications requiring ultimate strength and heat dissipation. Manufacturers build these packages using metal components, including heat sinks. You have better thermal conductivity and physical robustness. MBGAs are applied to demanding BGA PCB Assembly situations. They operate at peak functionality for high-demanding BGA Components.
Building very tiny devices? Micro BGAs provide the smallest possible footprint for BGA Components. You can stuff more functionality into a small BGA PCB. This type of BGA Assembly takes BGA miniaturization to a whole new level. Select Micro BGAs when space is your top priority in your BGA PCB Assembly.
Why Choose SMTFAB as Your BGA Assembly Supplier?
Choose SMTFAB’s proven expertise and full turnkey solutions for high-risk BGA Assembly projects. Quality, speed, and cost-effectiveness are assured even in complex BGA Components.
Extensive BGA Assembly Experience
We focus on key details necessary for successful production, especially with high-density interconnect (HDI) designs. Our careful DFM and DFA checks examine your layout and component choice to ensure the subtleties of properly positioning fine-pitch BGA components are handled before production. Take advantage of our experience to optimize your BGA PCB design for error-free and efficient BGA assembly.
Advanced In-House BGA Capabilities
Our large facility houses highly automated SMT lines optimized for precise BGA Assembly. Most significantly, we utilize advanced inspections like X-rays, which are essential in verifying solder joints under BGA components. This ensures high yields and reliability for your BGA PCB without the time delays of outsourcing.
Full Turnkey BGA Service
We do everything from sourcing special BGA components from reliable suppliers to the end of the BGA PCB Assembly. Our team effectively sources, inspects parts, and handles logistics. You receive quality components reliably mounted onto your BGA PCB without the inconvenience of having to manage inventory yourself.
Strict BGA Quality Assurance
Quality comes first in BGA Assembly. We conduct 100% AOI and obligatory X-ray checking to ensure that each connection of your BGA Components has no defects. Meeting IPC specifications confirms that your finished BGA PCB Assembly is most reliable.
IPC-A-610 Standard Adherence
We adhere to the IPC-A-610 standard rigidly in every BGA assembly process. It is the international standard used worldwide and specifies the industry standards of what is acceptable in electronic assemblies. It ensures your BGA components are soldered adequately on the BGA PCB. Complying with this standard gives you a high-quality and reliable end product. You receive boards produced to industry-approved standards.
Competitive BGA Pricing
Get affordable BGA Assembly with SMTFAB. We have No Minimum Order Quantity (MOQ) and usually give free stencils for your BGA PCB Assembly. Our factory’s lower costs and savings from buying many parts give you great value. You receive good prices even for detailed BGA Components and complex BGA PCB designs.
Prototype or Low-Volume
Do you require rapid prototypes of your BGA PCB layout? SMTFAB specializes in low-volume BGA Assembly. We know how important speed is when you need to confirm designs involving intricate BGA Components. For emergencies, you can use our 24-hour expedited service. Our prototype orders typically take 3-4 days. We will specify the actual lead time in your quote.
Global Support and Confidentiality
Rely on 24/7 technical and sales assistance for your BGA Assembly projects. We offer NDA options and export compliance to ensure the security of your sensitive BGA PCB designs and intellectual property.
Need Expert BGA Assembly?
Do you need professional BGA Assembly? Contact SMTFAB today. Send us your project files, and we will provide you with a free, no-obligation quote for your specific BGA Assembly requirements.
Why Choose SMTFAB as Your BGA Assembly Supplier?
Choose SMTFAB’s proven expertise and full turnkey solutions for high-risk BGA Assembly projects. Quality, speed, and cost-effectiveness are assured even in complex BGA Components.
Extensive BGA Assembly Experience
We focus on key details necessary for successful production, especially with high-density interconnect (HDI) designs. Our careful DFM and DFA checks examine your layout and component choice to ensure the subtleties of properly positioning fine-pitch BGA components are handled before production. Take advantage of our experience to optimize your BGA PCB design for error-free and efficient BGA assembly.
Advanced In-House BGA Capabilities
Our large facility houses highly automated SMT lines optimized for precise BGA Assembly. Most significantly, we utilize advanced inspections like X-rays, which are essential in verifying solder joints under BGA components. This ensures high yields and reliability for your BGA PCB without the time delays of outsourcing.
Full Turnkey BGA Service
We do everything from sourcing special BGA components from reliable suppliers to the end of the BGA PCB Assembly. Our team effectively sources, inspects parts, and handles logistics. You receive quality components reliably mounted onto your BGA PCB without the inconvenience of having to manage inventory yourself.
Strict BGA Quality Assurance
Quality comes first in BGA Assembly. We conduct 100% AOI and obligatory X-ray checking to ensure that each connection of your BGA Components has no defects. Meeting IPC specifications confirms that your finished BGA PCB Assembly is most reliable.
IPC-A-610 Standard Adherence
We adhere to the IPC-A-610 standard rigidly in every BGA assembly process. It is the international standard used worldwide and specifies the industry standards of what is acceptable in electronic assemblies. It ensures your BGA components are soldered adequately on the BGA PCB. Complying with this standard gives you a high-quality and reliable end product. You receive boards produced to industry-approved standards.
Competitive BGA Pricing
Get affordable BGA Assembly with SMTFAB. We have No Minimum Order Quantity (MOQ) and usually give free stencils for your BGA PCB Assembly. Our factory’s lower costs and savings from buying many parts give you great value. You receive good prices even for detailed BGA Components and complex BGA PCB designs.
Prototype or Low-Volume
Do you require rapid prototypes of your BGA PCB layout? SMTFAB specializes in low-volume BGA Assembly. We know how important speed is when you need to confirm designs involving intricate BGA Components. For emergencies, you can use our 24-hour expedited service. Our prototype orders typically take 3-4 days. We will specify the actual lead time in your quote.
Global Support and Confidentiality
Rely on 24/7 technical and sales assistance for your BGA Assembly projects. We offer NDA options and export compliance to ensure the security of your sensitive BGA PCB designs and intellectual property.
Need Expert BGA Assembly?
Do you need professional BGA Assembly? Contact SMTFAB today. Send us your project files, and we will provide you with a free, no-obligation quote for your specific BGA Assembly requirements.
Why Choose SMTFAB as Your BGA Assembly Supplier?
Choose SMTFAB’s proven expertise and full turnkey solutions for high-risk BGA Assembly projects. Quality, speed, and cost-effectiveness are assured even in complex BGA Components.
Extensive BGA Assembly Experience
We focus on key details necessary for successful production, especially with high-density interconnect (HDI) designs. Our careful DFM and DFA checks examine your layout and component choice to ensure the subtleties of properly positioning fine-pitch BGA components are handled before production. Take advantage of our experience to optimize your BGA PCB design for error-free and efficient BGA assembly.
Advanced In-House BGA Capabilities
Our large facility houses highly automated SMT lines optimized for precise BGA Assembly. Most significantly, we utilize advanced inspections like X-rays, which are essential in verifying solder joints under BGA components. This ensures high yields and reliability for your BGA PCB without the time delays of outsourcing.
Full Turnkey BGA Service
We do everything from sourcing special BGA components from reliable suppliers to the end of the BGA PCB Assembly. Our team effectively sources, inspects parts, and handles logistics. You receive quality components reliably mounted onto your BGA PCB without the inconvenience of having to manage inventory yourself.
Strict BGA Quality Assurance
Quality comes first in BGA Assembly. We conduct 100% AOI and obligatory X-ray checking to ensure that each connection of your BGA Components has no defects. Meeting IPC specifications confirms that your finished BGA PCB Assembly is most reliable.
IPC-A-610 Standard Adherence
We adhere to the IPC-A-610 standard rigidly in every BGA assembly process. It is the international standard used worldwide and specifies the industry standards of what is acceptable in electronic assemblies. It ensures your BGA components are soldered adequately on the BGA PCB. Complying with this standard gives you a high-quality and reliable end product. You receive boards produced to industry-approved standards.
Competitive BGA Pricing
Get affordable BGA Assembly with SMTFAB. We have No Minimum Order Quantity (MOQ) and usually give free stencils for your BGA PCB Assembly. Our factory’s lower costs and savings from buying many parts give you great value. You receive good prices even for detailed BGA Components and complex BGA PCB designs.
Prototype or Low-Volume
Do you require rapid prototypes of your BGA PCB layout? SMTFAB specializes in low-volume BGA Assembly. We know how important speed is when you need to confirm designs involving intricate BGA Components. For emergencies, you can use our 24-hour expedited service. Our prototype orders typically take 3-4 days. We will specify the actual lead time in your quote.
Global Support and Confidentiality
Rely on 24/7 technical and sales assistance for your BGA Assembly projects. We offer NDA options and export compliance to ensure the security of your sensitive BGA PCB designs and intellectual property.
Need Expert BGA Assembly?
Do you need professional BGA Assembly? Contact SMTFAB today. Send us your project files, and we will provide you with a free, no-obligation quote for your specific BGA Assembly requirements.
Why Choose SMTFAB as Your BGA Assembly Supplier?
Choose SMTFAB’s proven expertise and full turnkey solutions for high-risk BGA Assembly projects. Quality, speed, and cost-effectiveness are assured even in complex BGA Components.
Extensive BGA Assembly Experience
We focus on key details necessary for successful production, especially with high-density interconnect (HDI) designs. Our careful DFM and DFA checks examine your layout and component choice to ensure the subtleties of properly positioning fine-pitch BGA components are handled before production. Take advantage of our experience to optimize your BGA PCB design for error-free and efficient BGA assembly.
Advanced In-House BGA Capabilities
Our large facility houses highly automated SMT lines optimized for precise BGA Assembly. Most significantly, we utilize advanced inspections like X-rays, which are essential in verifying solder joints under BGA components. This ensures high yields and reliability for your BGA PCB without the time delays of outsourcing.
Full Turnkey BGA Service
We do everything from sourcing special BGA components from reliable suppliers to the end of the BGA PCB Assembly. Our team effectively sources, inspects parts, and handles logistics. You receive quality components reliably mounted onto your BGA PCB without the inconvenience of having to manage inventory yourself.
Strict BGA Quality Assurance
Quality comes first in BGA Assembly. We conduct 100% AOI and obligatory X-ray checking to ensure that each connection of your BGA Components has no defects. Meeting IPC specifications confirms that your finished BGA PCB Assembly is most reliable.
IPC-A-610 Standard Adherence
We adhere to the IPC-A-610 standard rigidly in every BGA assembly process. It is the international standard used worldwide and specifies the industry standards of what is acceptable in electronic assemblies. It ensures your BGA components are soldered adequately on the BGA PCB. Complying with this standard gives you a high-quality and reliable end product. You receive boards produced to industry-approved standards.
Competitive BGA Pricing
Get affordable BGA Assembly with SMTFAB. We have No Minimum Order Quantity (MOQ) and usually give free stencils for your BGA PCB Assembly. Our factory’s lower costs and savings from buying many parts give you great value. You receive good prices even for detailed BGA Components and complex BGA PCB designs.
Prototype or Low-Volume
Do you require rapid prototypes of your BGA PCB layout? SMTFAB specializes in low-volume BGA Assembly. We know how important speed is when you need to confirm designs involving intricate BGA Components. For emergencies, you can use our 24-hour expedited service. Our prototype orders typically take 3-4 days. We will specify the actual lead time in your quote.
Global Support and Confidentiality
Rely on 24/7 technical and sales assistance for your BGA Assembly projects. We offer NDA options and export compliance to ensure the security of your sensitive BGA PCB designs and intellectual property.
Need Expert BGA Assembly?
Do you need professional BGA Assembly? Contact SMTFAB today. Send us your project files, and we will provide you with a free, no-obligation quote for your specific BGA Assembly requirements.
Why Choose SMTFAB as Your BGA Assembly Supplier?
Choose SMTFAB’s proven expertise and full turnkey solutions for high-risk BGA Assembly projects. Quality, speed, and cost-effectiveness are assured even in complex BGA Components.
Extensive BGA Assembly Experience
We focus on key details necessary for successful production, especially with high-density interconnect (HDI) designs. Our careful DFM and DFA checks examine your layout and component choice to ensure the subtleties of properly positioning fine-pitch BGA components are handled before production. Take advantage of our experience to optimize your BGA PCB design for error-free and efficient BGA assembly.
Advanced In-House BGA Capabilities
Our large facility houses highly automated SMT lines optimized for precise BGA Assembly. Most significantly, we utilize advanced inspections like X-rays, which are essential in verifying solder joints under BGA components. This ensures high yields and reliability for your BGA PCB without the time delays of outsourcing.
Full Turnkey BGA Service
We do everything from sourcing special BGA components from reliable suppliers to the end of the BGA PCB Assembly. Our team effectively sources, inspects parts, and handles logistics. You receive quality components reliably mounted onto your BGA PCB without the inconvenience of having to manage inventory yourself.
Strict BGA Quality Assurance
Quality comes first in BGA Assembly. We conduct 100% AOI and obligatory X-ray checking to ensure that each connection of your BGA Components has no defects. Meeting IPC specifications confirms that your finished BGA PCB Assembly is most reliable.
IPC-A-610 Standard Adherence
We adhere to the IPC-A-610 standard rigidly in every BGA assembly process. It is the international standard used worldwide and specifies the industry standards of what is acceptable in electronic assemblies. It ensures your BGA components are soldered adequately on the BGA PCB. Complying with this standard gives you a high-quality and reliable end product. You receive boards produced to industry-approved standards.
Competitive BGA Pricing
Get affordable BGA Assembly with SMTFAB. We have No Minimum Order Quantity (MOQ) and usually give free stencils for your BGA PCB Assembly. Our factory’s lower costs and savings from buying many parts give you great value. You receive good prices even for detailed BGA Components and complex BGA PCB designs.
Prototype or Low-Volume
Do you require rapid prototypes of your BGA PCB layout? SMTFAB specializes in low-volume BGA Assembly. We know how important speed is when you need to confirm designs involving intricate BGA Components. For emergencies, you can use our 24-hour expedited service. Our prototype orders typically take 3-4 days. We will specify the actual lead time in your quote.
Global Support and Confidentiality
Rely on 24/7 technical and sales assistance for your BGA Assembly projects. We offer NDA options and export compliance to ensure the security of your sensitive BGA PCB designs and intellectual property.
Need Expert BGA Assembly?
Do you need professional BGA Assembly? Contact SMTFAB today. Send us your project files, and we will provide you with a free, no-obligation quote for your specific BGA Assembly requirements.
Choose SMTFAB’s proven expertise and full turnkey solutions for high-risk BGA Assembly projects. Quality, speed, and cost-effectiveness are assured even in complex BGA Components.
Extensive BGA Assembly Experience
We focus on key details necessary for successful production, especially with high-density interconnect (HDI) designs. Our careful DFM and DFA checks examine your layout and component choice to ensure the subtleties of properly positioning fine-pitch BGA components are handled before production. Take advantage of our experience to optimize your BGA PCB design for error-free and efficient BGA assembly.
Advanced In-House BGA Capabilities
Our large facility houses highly automated SMT lines optimized for precise BGA Assembly. Most significantly, we utilize advanced inspections like X-rays, which are essential in verifying solder joints under BGA components. This ensures high yields and reliability for your BGA PCB without the time delays of outsourcing.
Full Turnkey BGA Service
We do everything from sourcing special BGA components from reliable suppliers to the end of the BGA PCB Assembly. Our team effectively sources, inspects parts, and handles logistics. You receive quality components reliably mounted onto your BGA PCB without the inconvenience of having to manage inventory yourself.
Strict BGA Quality Assurance
Quality comes first in BGA Assembly. We conduct 100% AOI and obligatory X-ray checking to ensure that each connection of your BGA Components has no defects. Meeting IPC specifications confirms that your finished BGA PCB Assembly is most reliable.
IPC-A-610 Standard Adherence
We adhere to the IPC-A-610 standard rigidly in every BGA assembly process. It is the international standard used worldwide and specifies the industry standards of what is acceptable in electronic assemblies. It ensures your BGA components are soldered adequately on the BGA PCB. Complying with this standard gives you a high-quality and reliable end product. You receive boards produced to industry-approved standards.
Competitive BGA Pricing
Get affordable BGA Assembly with SMTFAB. We have No Minimum Order Quantity (MOQ) and usually give free stencils for your BGA PCB Assembly. Our factory’s lower costs and savings from buying many parts give you great value. You receive good prices even for detailed BGA Components and complex BGA PCB designs.
Prototype or Low-Volume
Do you require rapid prototypes of your BGA PCB layout? SMTFAB specializes in low-volume BGA Assembly. We know how important speed is when you need to confirm designs involving intricate BGA Components. For emergencies, you can use our 24-hour expedited service. Our prototype orders typically take 3-4 days. We will specify the actual lead time in your quote.
Global Support and Confidentiality
Rely on 24/7 technical and sales assistance for your BGA Assembly projects. We offer NDA options and export compliance to ensure the security of your sensitive BGA PCB designs and intellectual property.
Need Expert BGA Assembly?
Do you need professional BGA Assembly? Contact SMTFAB today. Send us your project files, and we will provide you with a free, no-obligation quote for your specific BGA Assembly requirements.
Related Products
Related Products
Related Products
Get an Instant Online Quote Today
Do you need a BGA Assembly expert and trusted provider? SMTFAB offers excellent BGA PCB Assembly services, leveraging extensive experience in dealing with those intricate components in a precise way. Our enterprise provides professional assembly for your BGA PCB schematics, guaranteeing precise and high-quality boards through our capable process. Let SMTFAB start working on your BGA Assembly project for your free quote now!
Get an Instant Online Quote Today
Do you need a BGA Assembly expert and trusted provider? SMTFAB offers excellent BGA PCB Assembly services, leveraging extensive experience in dealing with those intricate components in a precise way. Our enterprise provides professional assembly for your BGA PCB schematics, guaranteeing precise and high-quality boards through our capable process. Let SMTFAB start working on your BGA Assembly project for your free quote now!
Get an Instant Online Quote Today
Do you need a BGA Assembly expert and trusted provider? SMTFAB offers excellent BGA PCB Assembly services, leveraging extensive experience in dealing with those intricate components in a precise way. Our enterprise provides professional assembly for your BGA PCB schematics, guaranteeing precise and high-quality boards through our capable process. Let SMTFAB start working on your BGA Assembly project for your free quote now!
Get an Instant Online Quote Today
Do you need a BGA Assembly expert and trusted provider? SMTFAB offers excellent BGA PCB Assembly services, leveraging extensive experience in dealing with those intricate components in a precise way. Our enterprise provides professional assembly for your BGA PCB schematics, guaranteeing precise and high-quality boards through our capable process. Let SMTFAB start working on your BGA Assembly project for your free quote now!
Get an Instant Online Quote Today
Do you need a BGA Assembly expert and trusted provider? SMTFAB offers excellent BGA PCB Assembly services, leveraging extensive experience in dealing with those intricate components in a precise way. Our enterprise provides professional assembly for your BGA PCB schematics, guaranteeing precise and high-quality boards through our capable process. Let SMTFAB start working on your BGA Assembly project for your free quote now!
Do you need a BGA Assembly expert and trusted provider? SMTFAB offers excellent BGA PCB Assembly services, leveraging extensive experience in dealing with those intricate components in a precise way. Our enterprise provides professional assembly for your BGA PCB schematics, guaranteeing precise and high-quality boards through our capable process. Let SMTFAB start working on your BGA Assembly project for your free quote now!
Frequently Asked Questions
A BGA (Ball Grid Array) is an integrated circuit surface-mount package. Rather than pins, it features an array of solder balls on its bottom for contacts, providing more density on your BGA PCB.
The standard types of BGA Components are: PBGA (Plastic Ball Grid Array), CBGA (Ceramic Ball Grid Array), and TBGA (Tape Ball Grid Array), each suitable for differing application demands.
You would want to use BGA Components if your product needs high pin counts in a small space, such as microprocessors, FPGAs, ASICs, chipsets, or high-speed memory, where performance and space are paramount on the BGA PCB.
Although typical pitch sizes for BGA Components are between 0.5mm and 1.0mm, SMTFAB’s state-of-the-art BGA Assembly competencies enable us to work with much smaller pitches. We can consistently work with BGA Components with pitches as low as 0.2mm and single solder ball diameters of 0.14mm. This enables assembly of very high-density and intricate BGA packages.
Frequently Asked Questions
A BGA (Ball Grid Array) is an integrated circuit surface-mount package. Rather than pins, it features an array of solder balls on its bottom for contacts, providing more density on your BGA PCB.
The standard types of BGA Components are: PBGA (Plastic Ball Grid Array), CBGA (Ceramic Ball Grid Array), and TBGA (Tape Ball Grid Array), each suitable for differing application demands.
You would want to use BGA Components if your product needs high pin counts in a small space, such as microprocessors, FPGAs, ASICs, chipsets, or high-speed memory, where performance and space are paramount on the BGA PCB.
Although typical pitch sizes for BGA Components are between 0.5mm and 1.0mm, SMTFAB’s state-of-the-art BGA Assembly competencies enable us to work with much smaller pitches. We can consistently work with BGA Components with pitches as low as 0.2mm and single solder ball diameters of 0.14mm. This enables assembly of very high-density and intricate BGA packages.
Frequently Asked Questions
A BGA (Ball Grid Array) is an integrated circuit surface-mount package. Rather than pins, it features an array of solder balls on its bottom for contacts, providing more density on your BGA PCB.
The standard types of BGA Components are: PBGA (Plastic Ball Grid Array), CBGA (Ceramic Ball Grid Array), and TBGA (Tape Ball Grid Array), each suitable for differing application demands.
You would want to use BGA Components if your product needs high pin counts in a small space, such as microprocessors, FPGAs, ASICs, chipsets, or high-speed memory, where performance and space are paramount on the BGA PCB.
Although typical pitch sizes for BGA Components are between 0.5mm and 1.0mm, SMTFAB’s state-of-the-art BGA Assembly competencies enable us to work with much smaller pitches. We can consistently work with BGA Components with pitches as low as 0.2mm and single solder ball diameters of 0.14mm. This enables assembly of very high-density and intricate BGA packages.
Frequently Asked Questions
Frequently Asked Questions
A BGA (Ball Grid Array) is an integrated circuit surface-mount package. Rather than pins, it features an array of solder balls on its bottom for contacts, providing more density on your BGA PCB.
The standard types of BGA Components are: PBGA (Plastic Ball Grid Array), CBGA (Ceramic Ball Grid Array), and TBGA (Tape Ball Grid Array), each suitable for differing application demands.
You would want to use BGA Components if your product needs high pin counts in a small space, such as microprocessors, FPGAs, ASICs, chipsets, or high-speed memory, where performance and space are paramount on the BGA PCB.
Although typical pitch sizes for BGA Components are between 0.5mm and 1.0mm, SMTFAB’s state-of-the-art BGA Assembly competencies enable us to work with much smaller pitches. We can consistently work with BGA Components with pitches as low as 0.2mm and single solder ball diameters of 0.14mm. This enables assembly of very high-density and intricate BGA packages.
A BGA (Ball Grid Array) is an integrated circuit surface-mount package. Rather than pins, it features an array of solder balls on its bottom for contacts, providing more density on your BGA PCB.
A BGA (Ball Grid Array) is an integrated circuit surface-mount package. Rather than pins, it features an array of solder balls on its bottom for contacts, providing more density on your BGA PCB.
A BGA (Ball Grid Array) is an integrated circuit surface-mount package. Rather than pins, it features an array of solder balls on its bottom for contacts, providing more density on your BGA PCB.
The standard types of BGA Components are: PBGA (Plastic Ball Grid Array), CBGA (Ceramic Ball Grid Array), and TBGA (Tape Ball Grid Array), each suitable for differing application demands.
The standard types of BGA Components are: PBGA (Plastic Ball Grid Array), CBGA (Ceramic Ball Grid Array), and TBGA (Tape Ball Grid Array), each suitable for differing application demands.
The standard types of BGA Components are: PBGA (Plastic Ball Grid Array), CBGA (Ceramic Ball Grid Array), and TBGA (Tape Ball Grid Array), each suitable for differing application demands.
You would want to use BGA Components if your product needs high pin counts in a small space, such as microprocessors, FPGAs, ASICs, chipsets, or high-speed memory, where performance and space are paramount on the BGA PCB.
You would want to use BGA Components if your product needs high pin counts in a small space, such as microprocessors, FPGAs, ASICs, chipsets, or high-speed memory, where performance and space are paramount on the BGA PCB.
You would want to use BGA Components if your product needs high pin counts in a small space, such as microprocessors, FPGAs, ASICs, chipsets, or high-speed memory, where performance and space are paramount on the BGA PCB.
Although typical pitch sizes for BGA Components are between 0.5mm and 1.0mm, SMTFAB’s state-of-the-art BGA Assembly competencies enable us to work with much smaller pitches. We can consistently work with BGA Components with pitches as low as 0.2mm and single solder ball diameters of 0.14mm. This enables assembly of very high-density and intricate BGA packages.
Although typical pitch sizes for BGA Components are between 0.5mm and 1.0mm, SMTFAB’s state-of-the-art BGA Assembly competencies enable us to work with much smaller pitches. We can consistently work with BGA Components with pitches as low as 0.2mm and single solder ball diameters of 0.14mm. This enables assembly of very high-density and intricate BGA packages.
Although typical pitch sizes for BGA Components are between 0.5mm and 1.0mm, SMTFAB’s state-of-the-art BGA Assembly competencies enable us to work with much smaller pitches. We can consistently work with BGA Components with pitches as low as 0.2mm and single solder ball diameters of 0.14mm. This enables assembly of very high-density and intricate BGA packages.
Technical Specifications
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| 1008 | } |
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