
SMTFAB is a professional custom laser stencil manufacturer in China, who provides many different kinds of laser stencils.
| No. | Item | Process Capability Parameter |
| 1 | Order Quantity | ≥1PC |
| 2 | Quality Grade | IPC-A-610 |
| 3 | Lead Time | 24 hours expedited service can be offered. 3- 4 days normally for PCBA prototype orders. We will give you an accurate lead time when we quote for you. |
| 4 | Size | 50*50mm~510*460mm |
| 5 | Board Type | Rigid PCB, Flexible PCB, metal core PCB |
| 6 | Min Package | 01005 (0.4mm*0.2mm) |
| 7 | Max Package | No limit |
| 8 | Mounting Accuracy | ±0.035mm(±0.025mm) Cpk≥1.0 (3σ) |
| 9 | Surface Finish | Lead/Lead-free HASL, Immersion gold, OPS etc. |
| 10 | Assembly Types | Surface mount (SMT), Through-hole (DIP), Mixed Technology (SMT & Thru-hole) |
| 11 | Component Sourcing | Turnkey (All components sourced by SMTFAB), Partial turnkey, Kitted/Consigned |
| 12 | BGA Package | BGA Dia. 0.14mm, BGA 0.2mm pitch |
| 13 | SMT Parts Presentation | Cut Tape, Partial reel, Reel, Tube, Tray, Laser-cut Stainless Steel |
| 14 | Cable Assembly | We supply custom cables, cable assemblies, wiring looms/harnesses and power leads for various industries including automotive, security, mining, medical, and entertainment. |
| 15 | Stencil | Stencil with or without frame (offered free by SMTFAB) |
| 16 | Quality Inspection | Visual inspection; AOI checking; BGA placement – X-RAY checking |
| 17 | SMT Capacity | 3 Million~4 Million Soldering Pad/day |
| 18 | DIP Capacity | 100 Thousand Pins/day |
1, What Is Laser Stencil?
It’s a solder-paste stencil that has been laser cut. The paste is applied through the stencil, the thickness of the stencil determining the quantity of paste applied.
2, How Do You Use A Laser Cut Stencil?
3, What Is The Best Material For Making Stencils?
The most common material for stencils is Mylar – and for good reason. It is flexible, durable, easy to clean, and long-lasting. 10mil Mylar is our preferred thickness for its flexibility, durability, and versatility. Other options include adhesive-backed mylar, magnetic, acrylic, or wood stencils.
4, What Is PCB Stencil?
A PCB Stencil is a sheet of stainless steel with laser-cut openings used to place solder paste on a PCB board for surface mount component placement. The PCB stencil is used to deposit solder paste on designated places on a bare PCB board so that components can be placed and perfectly aligned on the board.
5, How Do You Clean Solder Stencils?
Currently, as needed, our EMS contractor wipes the bottom side (board contact side) of each solder paste stencil using lint-free wipes saturated with IPA. Then once every 4 hours they remove each solder paste stencil from the screen printers and wipe both sides using IPA saturated lint-free wipes.
6, Do You Need Flux To Solder Wire?
Additional flux is unnecessary for most applications, but using additional flux still may make the solder easier to work with for some tasks. When selecting flux core solder, it is important to use rosin core solder for electrical applications. Acid core solder should only be used for plumbing applications.
Are you looking for a professional laser stencil manufacturer in China? SMTFAB is your best choice.
We can provide frame stencils and frameless stencils for you. It depends on the type of laser stencil you use, you can apply the paste with hands or a machine.
When you design the laser stencil, please pay close attention to these characters like the thickness of the stencil, aperture size, size of the laser stencil, and durability.
Our PCB assembly plant has a workshop of 8,000 square meters and over 500 workers. There are 6 fully automatic SMT production lines, 3 wave soldering production lines, 5 assembly lines, and auxiliary testing and aging facilities.
Whoever you are an electrical engineer, a purchasing manager, a project manager, or a product designer looking for a laser stencil of PCB assembly, SMTFAB will be your excellent laser stencil and PCB assembly supplier in China.
Send us your Gerber data and BOM list files, you will get an awesome product.
Laser Stencils or calls SMT Stencils are used to print solder paste on the PCBs for assembly components.
They are often made of Stainless Steel and are manufactured by processes of laser cut or etching.
Stencil Stencil is the process of depositing solder paste on the PCB to establish electrical connections.
it is to achieve through a single material namely solder paste which consists of solder metal and flux.
The equipment and materials used in this stage are laser stencil, solder paste, and Paste printer.
In order to meet a good solder joint, the right volume of solder paste needs to be printed, the component needs to be placed in the right solder pads, the solder paste needs to wet well on the board, and also must be clean enough for SMT stencil printing.
With laser stencil technology, it is possible to create durable stencils in wood, Plexiglas, polypropylene, or pressed cardboard for a few dozen sprays according to your needs.
In order to be able to solder SMD components on the circuit board, a sufficient solder depot must be available.
The end surfaces on the circuit board, such as HAL, are usually not sufficient for this.
For this reason, a solder paste is applied to the pads for SMD components.
The paste is applied with a laser-cut metal template. This is commonly referred to as an SMD stencil or stencil.
So that the SMD components cannot slip on the circuit board during the soldering process, they are fixed with an adhesive.
The adhesive can also be applied using a laser-cut metal template.

laser Stencil
Sufficiently smooth walls and tapered apertures. This ensures that the solder paste easily passes through the apertures of the stencil when it is lifted from the print cycle.
The solution to the problem of making precision stencils was again proposed by laser processing of the material.
After all, the necessary holes do not have to be made by chemical etching.
They can also be made by direct laser processing of the material. In this case, on the one hand, it is possible to significantly increase the accuracy of maintaining the required hole shape.
And on the other hand, the hole profile can be much closer to rectangular.
The dosage of the solder paste applied using such Laser Stencil will be much more accurate.
It will drastically reduce the rejects during soldering. In addition, after laser processing, the holes have a slightly trapezoidal wall shape.
The open portion of the aperture is usually slightly larger on the lower side.
This shape of the hole provides better peeling of the solder paste from the walls of the hole when removing the stencil.
The second significant advantage of Laser Stencil is the material used for their manufacture.
The absence of photochemical etching operations made it possible to abandon the use of special grades of bronze.
For the manufacture of stencils by laser processing, tough grades of stainless steel are used.
It resists wearing significantly better than metals suitable for photochemical etching.
When creating printed circuit boards of varying complexity, the methods of SMD and DIP mounting of elements are used.
The first method of fixing components is applied after applying solder paste.
Stencils for surface mounting are used for its distribution. Their use in the preparation process is characterized by many advantages:
The clarity of the lines along which the solder paste is distributed and its dosage directly affect the quality of the installation.
Since the pins of the surface components are at the same level, the track heights or contours of the pads are not allowed.
It is not possible to achieve perfectly uniform distribution even in manual mode.
Since squeezing the paste out of the syringe does not guarantee an accurate dosage.

Paste on PCB
Products for precise distribution and dosing of solder paste are:
Stencils of the first type are plates in which the apertures are at the same level.
They are used for most printed circuit boards. Their use is relevant in cases when it is required to fix elements with leads of the same length on the plate.
More complex printed circuit boards are often created using chips of different sizes.
In this case, the conclusions of some elements are shorter, others are longer.
To solder them, it is required to apply the paste in layers of different thicknesses.
In such cases, Laser Stencil is required. They are plates with protruding or recessed areas against the background of the main surface.
If the platform protrudes, then the walls of the apertures have a greater height. The paste is spread over them in thicker layers.
If the platform is recessed, then the walls of the apertures have a lower height. Accordingly, the paste is distributed over them in thin layers.

Paste for PCB
Here at SMTFAB, we could provide custom stencils of different sizes and thicknesses, when you have this kind of laser stencil or SMT stencil, please send the inquiry to us.
SMTFAB is a professional custom laser stencil manufacturer in China, who provides many different kinds of laser stencils.
| No. | Item | Process Capability Parameter |
| 1 | Order Quantity | ≥1PC |
| 2 | Quality Grade | IPC-A-610 |
| 3 | Lead Time | 24 hours expedited service can be offered. 3- 4 days normally for PCBA prototype orders. We will give you an accurate lead time when we quote for you. |
| 4 | Size | 50*50mm~510*460mm |
| 5 | Board Type | Rigid PCB, Flexible PCB, metal core PCB |
| 6 | Min Package | 01005 (0.4mm*0.2mm) |
| 7 | Max Package | No limit |
| 8 | Mounting Accuracy | ±0.035mm(±0.025mm) Cpk≥1.0 (3σ) |
| 9 | Surface Finish | Lead/Lead-free HASL, Immersion gold, OPS etc. |
| 10 | Assembly Types | Surface mount (SMT), Through-hole (DIP), Mixed Technology (SMT & Thru-hole) |
| 11 | Component Sourcing | Turnkey (All components sourced by SMTFAB), Partial turnkey, Kitted/Consigned |
| 12 | BGA Package | BGA Dia. 0.14mm, BGA 0.2mm pitch |
| 13 | SMT Parts Presentation | Cut Tape, Partial reel, Reel, Tube, Tray, Laser-cut Stainless Steel |
| 14 | Cable Assembly | We supply custom cables, cable assemblies, wiring looms/harnesses and power leads for various industries including automotive, security, mining, medical, and entertainment. |
| 15 | Stencil | Stencil with or without frame (offered free by SMTFAB) |
| 16 | Quality Inspection | Visual inspection; AOI checking; BGA placement – X-RAY checking |
| 17 | SMT Capacity | 3 Million~4 Million Soldering Pad/day |
| 18 | DIP Capacity | 100 Thousand Pins/day |
1, What Is Laser Stencil?
It’s a solder-paste stencil that has been laser cut. The paste is applied through the stencil, the thickness of the stencil determining the quantity of paste applied.
2, How Do You Use A Laser Cut Stencil?
3, What Is The Best Material For Making Stencils?
The most common material for stencils is Mylar – and for good reason. It is flexible, durable, easy to clean, and long-lasting. 10mil Mylar is our preferred thickness for its flexibility, durability, and versatility. Other options include adhesive-backed mylar, magnetic, acrylic, or wood stencils.
4, What Is PCB Stencil?
A PCB Stencil is a sheet of stainless steel with laser-cut openings used to place solder paste on a PCB board for surface mount component placement. The PCB stencil is used to deposit solder paste on designated places on a bare PCB board so that components can be placed and perfectly aligned on the board.
5, How Do You Clean Solder Stencils?
Currently, as needed, our EMS contractor wipes the bottom side (board contact side) of each solder paste stencil using lint-free wipes saturated with IPA. Then once every 4 hours they remove each solder paste stencil from the screen printers and wipe both sides using IPA saturated lint-free wipes.
6, Do You Need Flux To Solder Wire?
Additional flux is unnecessary for most applications, but using additional flux still may make the solder easier to work with for some tasks. When selecting flux core solder, it is important to use rosin core solder for electrical applications. Acid core solder should only be used for plumbing applications.
Are you looking for a professional laser stencil manufacturer in China? SMTFAB is your best choice.
We can provide frame stencils and frameless stencils for you. It depends on the type of laser stencil you use, you can apply the paste with hands or a machine.
When you design the laser stencil, please pay close attention to these characters like the thickness of the stencil, aperture size, size of the laser stencil, and durability.
Our PCB assembly plant has a workshop of 8,000 square meters and over 500 workers. There are 6 fully automatic SMT production lines, 3 wave soldering production lines, 5 assembly lines, and auxiliary testing and aging facilities.
Whoever you are an electrical engineer, a purchasing manager, a project manager, or a product designer looking for a laser stencil of PCB assembly, SMTFAB will be your excellent laser stencil and PCB assembly supplier in China.
Send us your Gerber data and BOM list files, you will get an awesome product.
Laser Stencils or calls SMT Stencils are used to print solder paste on the PCBs for assembly components.
They are often made of Stainless Steel and are manufactured by processes of laser cut or etching.
Stencil Stencil is the process of depositing solder paste on the PCB to establish electrical connections.
it is to achieve through a single material namely solder paste which consists of solder metal and flux.
The equipment and materials used in this stage are laser stencil, solder paste, and Paste printer.
In order to meet a good solder joint, the right volume of solder paste needs to be printed, the component needs to be placed in the right solder pads, the solder paste needs to wet well on the board, and also must be clean enough for SMT stencil printing.
With laser stencil technology, it is possible to create durable stencils in wood, Plexiglas, polypropylene, or pressed cardboard for a few dozen sprays according to your needs.
In order to be able to solder SMD components on the circuit board, a sufficient solder depot must be available.
The end surfaces on the circuit board, such as HAL, are usually not sufficient for this.
For this reason, a solder paste is applied to the pads for SMD components.
The paste is applied with a laser-cut metal template. This is commonly referred to as an SMD stencil or stencil.
So that the SMD components cannot slip on the circuit board during the soldering process, they are fixed with an adhesive.
The adhesive can also be applied using a laser-cut metal template.

laser Stencil
Sufficiently smooth walls and tapered apertures. This ensures that the solder paste easily passes through the apertures of the stencil when it is lifted from the print cycle.
The solution to the problem of making precision stencils was again proposed by laser processing of the material.
After all, the necessary holes do not have to be made by chemical etching.
They can also be made by direct laser processing of the material. In this case, on the one hand, it is possible to significantly increase the accuracy of maintaining the required hole shape.
And on the other hand, the hole profile can be much closer to rectangular.
The dosage of the solder paste applied using such Laser Stencil will be much more accurate.
It will drastically reduce the rejects during soldering. In addition, after laser processing, the holes have a slightly trapezoidal wall shape.
The open portion of the aperture is usually slightly larger on the lower side.
This shape of the hole provides better peeling of the solder paste from the walls of the hole when removing the stencil.
The second significant advantage of Laser Stencil is the material used for their manufacture.
The absence of photochemical etching operations made it possible to abandon the use of special grades of bronze.
For the manufacture of stencils by laser processing, tough grades of stainless steel are used.
It resists wearing significantly better than metals suitable for photochemical etching.
When creating printed circuit boards of varying complexity, the methods of SMD and DIP mounting of elements are used.
The first method of fixing components is applied after applying solder paste.
Stencils for surface mounting are used for its distribution. Their use in the preparation process is characterized by many advantages:
The clarity of the lines along which the solder paste is distributed and its dosage directly affect the quality of the installation.
Since the pins of the surface components are at the same level, the track heights or contours of the pads are not allowed.
It is not possible to achieve perfectly uniform distribution even in manual mode.
Since squeezing the paste out of the syringe does not guarantee an accurate dosage.

Paste on PCB
Products for precise distribution and dosing of solder paste are:
Stencils of the first type are plates in which the apertures are at the same level.
They are used for most printed circuit boards. Their use is relevant in cases when it is required to fix elements with leads of the same length on the plate.
More complex printed circuit boards are often created using chips of different sizes.
In this case, the conclusions of some elements are shorter, others are longer.
To solder them, it is required to apply the paste in layers of different thicknesses.
In such cases, Laser Stencil is required. They are plates with protruding or recessed areas against the background of the main surface.
If the platform protrudes, then the walls of the apertures have a greater height. The paste is spread over them in thicker layers.
If the platform is recessed, then the walls of the apertures have a lower height. Accordingly, the paste is distributed over them in thin layers.

Paste for PCB
Here at SMTFAB, we could provide custom stencils of different sizes and thicknesses, when you have this kind of laser stencil or SMT stencil, please send the inquiry to us.
SMTFAB is a professional custom laser stencil manufacturer in China, who provides many different kinds of laser stencils.
| No. | Item | Process Capability Parameter |
| 1 | Order Quantity | ≥1PC |
| 2 | Quality Grade | IPC-A-610 |
| 3 | Lead Time | 24 hours expedited service can be offered. 3- 4 days normally for PCBA prototype orders. We will give you an accurate lead time when we quote for you. |
| 4 | Size | 50*50mm~510*460mm |
| 5 | Board Type | Rigid PCB, Flexible PCB, metal core PCB |
| 6 | Min Package | 01005 (0.4mm*0.2mm) |
| 7 | Max Package | No limit |
| 8 | Mounting Accuracy | ±0.035mm(±0.025mm) Cpk≥1.0 (3σ) |
| 9 | Surface Finish | Lead/Lead-free HASL, Immersion gold, OPS etc. |
| 10 | Assembly Types | Surface mount (SMT), Through-hole (DIP), Mixed Technology (SMT & Thru-hole) |
| 11 | Component Sourcing | Turnkey (All components sourced by SMTFAB), Partial turnkey, Kitted/Consigned |
| 12 | BGA Package | BGA Dia. 0.14mm, BGA 0.2mm pitch |
| 13 | SMT Parts Presentation | Cut Tape, Partial reel, Reel, Tube, Tray, Laser-cut Stainless Steel |
| 14 | Cable Assembly | We supply custom cables, cable assemblies, wiring looms/harnesses and power leads for various industries including automotive, security, mining, medical, and entertainment. |
| 15 | Stencil | Stencil with or without frame (offered free by SMTFAB) |
| 16 | Quality Inspection | Visual inspection; AOI checking; BGA placement – X-RAY checking |
| 17 | SMT Capacity | 3 Million~4 Million Soldering Pad/day |
| 18 | DIP Capacity | 100 Thousand Pins/day |
1, What Is Laser Stencil?
It’s a solder-paste stencil that has been laser cut. The paste is applied through the stencil, the thickness of the stencil determining the quantity of paste applied.
2, How Do You Use A Laser Cut Stencil?
3, What Is The Best Material For Making Stencils?
The most common material for stencils is Mylar – and for good reason. It is flexible, durable, easy to clean, and long-lasting. 10mil Mylar is our preferred thickness for its flexibility, durability, and versatility. Other options include adhesive-backed mylar, magnetic, acrylic, or wood stencils.
4, What Is PCB Stencil?
A PCB Stencil is a sheet of stainless steel with laser-cut openings used to place solder paste on a PCB board for surface mount component placement. The PCB stencil is used to deposit solder paste on designated places on a bare PCB board so that components can be placed and perfectly aligned on the board.
5, How Do You Clean Solder Stencils?
Currently, as needed, our EMS contractor wipes the bottom side (board contact side) of each solder paste stencil using lint-free wipes saturated with IPA. Then once every 4 hours they remove each solder paste stencil from the screen printers and wipe both sides using IPA saturated lint-free wipes.
6, Do You Need Flux To Solder Wire?
Additional flux is unnecessary for most applications, but using additional flux still may make the solder easier to work with for some tasks. When selecting flux core solder, it is important to use rosin core solder for electrical applications. Acid core solder should only be used for plumbing applications.
Are you looking for a professional laser stencil manufacturer in China? SMTFAB is your best choice.
We can provide frame stencils and frameless stencils for you. It depends on the type of laser stencil you use, you can apply the paste with hands or a machine.
When you design the laser stencil, please pay close attention to these characters like the thickness of the stencil, aperture size, size of the laser stencil, and durability.
Our PCB assembly plant has a workshop of 8,000 square meters and over 500 workers. There are 6 fully automatic SMT production lines, 3 wave soldering production lines, 5 assembly lines, and auxiliary testing and aging facilities.
Whoever you are an electrical engineer, a purchasing manager, a project manager, or a product designer looking for a laser stencil of PCB assembly, SMTFAB will be your excellent laser stencil and PCB assembly supplier in China.
Send us your Gerber data and BOM list files, you will get an awesome product.
Laser Stencils or calls SMT Stencils are used to print solder paste on the PCBs for assembly components.
They are often made of Stainless Steel and are manufactured by processes of laser cut or etching.
Stencil Stencil is the process of depositing solder paste on the PCB to establish electrical connections.
it is to achieve through a single material namely solder paste which consists of solder metal and flux.
The equipment and materials used in this stage are laser stencil, solder paste, and Paste printer.
In order to meet a good solder joint, the right volume of solder paste needs to be printed, the component needs to be placed in the right solder pads, the solder paste needs to wet well on the board, and also must be clean enough for SMT stencil printing.
With laser stencil technology, it is possible to create durable stencils in wood, Plexiglas, polypropylene, or pressed cardboard for a few dozen sprays according to your needs.
In order to be able to solder SMD components on the circuit board, a sufficient solder depot must be available.
The end surfaces on the circuit board, such as HAL, are usually not sufficient for this.
For this reason, a solder paste is applied to the pads for SMD components.
The paste is applied with a laser-cut metal template. This is commonly referred to as an SMD stencil or stencil.
So that the SMD components cannot slip on the circuit board during the soldering process, they are fixed with an adhesive.
The adhesive can also be applied using a laser-cut metal template.

laser Stencil
Sufficiently smooth walls and tapered apertures. This ensures that the solder paste easily passes through the apertures of the stencil when it is lifted from the print cycle.
The solution to the problem of making precision stencils was again proposed by laser processing of the material.
After all, the necessary holes do not have to be made by chemical etching.
They can also be made by direct laser processing of the material. In this case, on the one hand, it is possible to significantly increase the accuracy of maintaining the required hole shape.
And on the other hand, the hole profile can be much closer to rectangular.
The dosage of the solder paste applied using such Laser Stencil will be much more accurate.
It will drastically reduce the rejects during soldering. In addition, after laser processing, the holes have a slightly trapezoidal wall shape.
The open portion of the aperture is usually slightly larger on the lower side.
This shape of the hole provides better peeling of the solder paste from the walls of the hole when removing the stencil.
The second significant advantage of Laser Stencil is the material used for their manufacture.
The absence of photochemical etching operations made it possible to abandon the use of special grades of bronze.
For the manufacture of stencils by laser processing, tough grades of stainless steel are used.
It resists wearing significantly better than metals suitable for photochemical etching.
When creating printed circuit boards of varying complexity, the methods of SMD and DIP mounting of elements are used.
The first method of fixing components is applied after applying solder paste.
Stencils for surface mounting are used for its distribution. Their use in the preparation process is characterized by many advantages:
The clarity of the lines along which the solder paste is distributed and its dosage directly affect the quality of the installation.
Since the pins of the surface components are at the same level, the track heights or contours of the pads are not allowed.
It is not possible to achieve perfectly uniform distribution even in manual mode.
Since squeezing the paste out of the syringe does not guarantee an accurate dosage.

Paste on PCB
Products for precise distribution and dosing of solder paste are:
Stencils of the first type are plates in which the apertures are at the same level.
They are used for most printed circuit boards. Their use is relevant in cases when it is required to fix elements with leads of the same length on the plate.
More complex printed circuit boards are often created using chips of different sizes.
In this case, the conclusions of some elements are shorter, others are longer.
To solder them, it is required to apply the paste in layers of different thicknesses.
In such cases, Laser Stencil is required. They are plates with protruding or recessed areas against the background of the main surface.
If the platform protrudes, then the walls of the apertures have a greater height. The paste is spread over them in thicker layers.
If the platform is recessed, then the walls of the apertures have a lower height. Accordingly, the paste is distributed over them in thin layers.

Paste for PCB
Here at SMTFAB, we could provide custom stencils of different sizes and thicknesses, when you have this kind of laser stencil or SMT stencil, please send the inquiry to us.
SMTFAB is a professional custom laser stencil manufacturer in China, who provides many different kinds of laser stencils.
SMTFAB is a professional custom laser stencil manufacturer in China, who provides many different kinds of laser stencils.
SMTFAB is a professional custom laser stencil manufacturer in China, who provides many different kinds of laser stencils.
SMTFAB is a professional custom laser stencil manufacturer in China, who provides many different kinds of laser stencils.
SMTFAB is a professional custom laser stencil manufacturer in China, who provides many different kinds of laser stencils.
SMTFAB is a professional custom laser stencil manufacturer in China, who provides many different kinds of laser stencils.
SMTFAB is a professional custom laser stencil manufacturer in China, who provides many different kinds of laser stencils.
| No. | Item | Process Capability Parameter |
| 1 | Order Quantity | ≥1PC |
| 2 | Quality Grade | IPC-A-610 |
| 3 | Lead Time | 24 hours expedited service can be offered. 3- 4 days normally for PCBA prototype orders. We will give you an accurate lead time when we quote for you. |
| 4 | Size | 50*50mm~510*460mm |
| 5 | Board Type | Rigid PCB, Flexible PCB, metal core PCB |
| 6 | Min Package | 01005 (0.4mm*0.2mm) |
| 7 | Max Package | No limit |
| 8 | Mounting Accuracy | ±0.035mm(±0.025mm) Cpk≥1.0 (3σ) |
| 9 | Surface Finish | Lead/Lead-free HASL, Immersion gold, OPS etc. |
| 10 | Assembly Types | Surface mount (SMT), Through-hole (DIP), Mixed Technology (SMT & Thru-hole) |
| 11 | Component Sourcing | Turnkey (All components sourced by SMTFAB), Partial turnkey, Kitted/Consigned |
| 12 | BGA Package | BGA Dia. 0.14mm, BGA 0.2mm pitch |
| 13 | SMT Parts Presentation | Cut Tape, Partial reel, Reel, Tube, Tray, Laser-cut Stainless Steel |
| 14 | Cable Assembly | We supply custom cables, cable assemblies, wiring looms/harnesses and power leads for various industries including automotive, security, mining, medical, and entertainment. |
| 15 | Stencil | Stencil with or without frame (offered free by SMTFAB) |
| 16 | Quality Inspection | Visual inspection; AOI checking; BGA placement – X-RAY checking |
| 17 | SMT Capacity | 3 Million~4 Million Soldering Pad/day |
| 18 | DIP Capacity | 100 Thousand Pins/day |
1, What Is Laser Stencil?
It’s a solder-paste stencil that has been laser cut. The paste is applied through the stencil, the thickness of the stencil determining the quantity of paste applied.
2, How Do You Use A Laser Cut Stencil?
3, What Is The Best Material For Making Stencils?
The most common material for stencils is Mylar – and for good reason. It is flexible, durable, easy to clean, and long-lasting. 10mil Mylar is our preferred thickness for its flexibility, durability, and versatility. Other options include adhesive-backed mylar, magnetic, acrylic, or wood stencils.
4, What Is PCB Stencil?
A PCB Stencil is a sheet of stainless steel with laser-cut openings used to place solder paste on a PCB board for surface mount component placement. The PCB stencil is used to deposit solder paste on designated places on a bare PCB board so that components can be placed and perfectly aligned on the board.
5, How Do You Clean Solder Stencils?
Currently, as needed, our EMS contractor wipes the bottom side (board contact side) of each solder paste stencil using lint-free wipes saturated with IPA. Then once every 4 hours they remove each solder paste stencil from the screen printers and wipe both sides using IPA saturated lint-free wipes.
6, Do You Need Flux To Solder Wire?
Additional flux is unnecessary for most applications, but using additional flux still may make the solder easier to work with for some tasks. When selecting flux core solder, it is important to use rosin core solder for electrical applications. Acid core solder should only be used for plumbing applications.
| No. | Item | Process Capability Parameter |
| 1 | Order Quantity | ≥1PC |
| 2 | Quality Grade | IPC-A-610 |
| 3 | Lead Time | 24 hours expedited service can be offered. 3- 4 days normally for PCBA prototype orders. We will give you an accurate lead time when we quote for you. |
| 4 | Size | 50*50mm~510*460mm |
| 5 | Board Type | Rigid PCB, Flexible PCB, metal core PCB |
| 6 | Min Package | 01005 (0.4mm*0.2mm) |
| 7 | Max Package | No limit |
| 8 | Mounting Accuracy | ±0.035mm(±0.025mm) Cpk≥1.0 (3σ) |
| 9 | Surface Finish | Lead/Lead-free HASL, Immersion gold, OPS etc. |
| 10 | Assembly Types | Surface mount (SMT), Through-hole (DIP), Mixed Technology (SMT & Thru-hole) |
| 11 | Component Sourcing | Turnkey (All components sourced by SMTFAB), Partial turnkey, Kitted/Consigned |
| 12 | BGA Package | BGA Dia. 0.14mm, BGA 0.2mm pitch |
| 13 | SMT Parts Presentation | Cut Tape, Partial reel, Reel, Tube, Tray, Laser-cut Stainless Steel |
| 14 | Cable Assembly | We supply custom cables, cable assemblies, wiring looms/harnesses and power leads for various industries including automotive, security, mining, medical, and entertainment. |
| 15 | Stencil | Stencil with or without frame (offered free by SMTFAB) |
| 16 | Quality Inspection | Visual inspection; AOI checking; BGA placement – X-RAY checking |
| 17 | SMT Capacity | 3 Million~4 Million Soldering Pad/day |
| 18 | DIP Capacity | 100 Thousand Pins/day |
1, What Is Laser Stencil?
It’s a solder-paste stencil that has been laser cut. The paste is applied through the stencil, the thickness of the stencil determining the quantity of paste applied.
2, How Do You Use A Laser Cut Stencil?
3, What Is The Best Material For Making Stencils?
The most common material for stencils is Mylar – and for good reason. It is flexible, durable, easy to clean, and long-lasting. 10mil Mylar is our preferred thickness for its flexibility, durability, and versatility. Other options include adhesive-backed mylar, magnetic, acrylic, or wood stencils.
4, What Is PCB Stencil?
A PCB Stencil is a sheet of stainless steel with laser-cut openings used to place solder paste on a PCB board for surface mount component placement. The PCB stencil is used to deposit solder paste on designated places on a bare PCB board so that components can be placed and perfectly aligned on the board.
5, How Do You Clean Solder Stencils?
Currently, as needed, our EMS contractor wipes the bottom side (board contact side) of each solder paste stencil using lint-free wipes saturated with IPA. Then once every 4 hours they remove each solder paste stencil from the screen printers and wipe both sides using IPA saturated lint-free wipes.
6, Do You Need Flux To Solder Wire?
Additional flux is unnecessary for most applications, but using additional flux still may make the solder easier to work with for some tasks. When selecting flux core solder, it is important to use rosin core solder for electrical applications. Acid core solder should only be used for plumbing applications.
| No. | Item | Process Capability Parameter |
| 1 | Order Quantity | ≥1PC |
| 2 | Quality Grade | IPC-A-610 |
| 3 | Lead Time | 24 hours expedited service can be offered. 3- 4 days normally for PCBA prototype orders. We will give you an accurate lead time when we quote for you. |
| 4 | Size | 50*50mm~510*460mm |
| 5 | Board Type | Rigid PCB, Flexible PCB, metal core PCB |
| 6 | Min Package | 01005 (0.4mm*0.2mm) |
| 7 | Max Package | No limit |
| 8 | Mounting Accuracy | ±0.035mm(±0.025mm) Cpk≥1.0 (3σ) |
| 9 | Surface Finish | Lead/Lead-free HASL, Immersion gold, OPS etc. |
| 10 | Assembly Types | Surface mount (SMT), Through-hole (DIP), Mixed Technology (SMT & Thru-hole) |
| 11 | Component Sourcing | Turnkey (All components sourced by SMTFAB), Partial turnkey, Kitted/Consigned |
| 12 | BGA Package | BGA Dia. 0.14mm, BGA 0.2mm pitch |
| 13 | SMT Parts Presentation | Cut Tape, Partial reel, Reel, Tube, Tray, Laser-cut Stainless Steel |
| 14 | Cable Assembly | We supply custom cables, cable assemblies, wiring looms/harnesses and power leads for various industries including automotive, security, mining, medical, and entertainment. |
| 15 | Stencil | Stencil with or without frame (offered free by SMTFAB) |
| 16 | Quality Inspection | Visual inspection; AOI checking; BGA placement – X-RAY checking |
| 17 | SMT Capacity | 3 Million~4 Million Soldering Pad/day |
| 18 | DIP Capacity | 100 Thousand Pins/day |
1, What Is Laser Stencil?
It’s a solder-paste stencil that has been laser cut. The paste is applied through the stencil, the thickness of the stencil determining the quantity of paste applied.
2, How Do You Use A Laser Cut Stencil?
3, What Is The Best Material For Making Stencils?
The most common material for stencils is Mylar – and for good reason. It is flexible, durable, easy to clean, and long-lasting. 10mil Mylar is our preferred thickness for its flexibility, durability, and versatility. Other options include adhesive-backed mylar, magnetic, acrylic, or wood stencils.
4, What Is PCB Stencil?
A PCB Stencil is a sheet of stainless steel with laser-cut openings used to place solder paste on a PCB board for surface mount component placement. The PCB stencil is used to deposit solder paste on designated places on a bare PCB board so that components can be placed and perfectly aligned on the board.
5, How Do You Clean Solder Stencils?
Currently, as needed, our EMS contractor wipes the bottom side (board contact side) of each solder paste stencil using lint-free wipes saturated with IPA. Then once every 4 hours they remove each solder paste stencil from the screen printers and wipe both sides using IPA saturated lint-free wipes.
6, Do You Need Flux To Solder Wire?
Additional flux is unnecessary for most applications, but using additional flux still may make the solder easier to work with for some tasks. When selecting flux core solder, it is important to use rosin core solder for electrical applications. Acid core solder should only be used for plumbing applications.
| No. | Item | Process Capability Parameter |
| 1 | Order Quantity | ≥1PC |
| 2 | Quality Grade | IPC-A-610 |
| 3 | Lead Time | 24 hours expedited service can be offered. 3- 4 days normally for PCBA prototype orders. We will give you an accurate lead time when we quote for you. |
| 4 | Size | 50*50mm~510*460mm |
| 5 | Board Type | Rigid PCB, Flexible PCB, metal core PCB |
| 6 | Min Package | 01005 (0.4mm*0.2mm) |
| 7 | Max Package | No limit |
| 8 | Mounting Accuracy | ±0.035mm(±0.025mm) Cpk≥1.0 (3σ) |
| 9 | Surface Finish | Lead/Lead-free HASL, Immersion gold, OPS etc. |
| 10 | Assembly Types | Surface mount (SMT), Through-hole (DIP), Mixed Technology (SMT & Thru-hole) |
| 11 | Component Sourcing | Turnkey (All components sourced by SMTFAB), Partial turnkey, Kitted/Consigned |
| 12 | BGA Package | BGA Dia. 0.14mm, BGA 0.2mm pitch |
| 13 | SMT Parts Presentation | Cut Tape, Partial reel, Reel, Tube, Tray, Laser-cut Stainless Steel |
| 14 | Cable Assembly | We supply custom cables, cable assemblies, wiring looms/harnesses and power leads for various industries including automotive, security, mining, medical, and entertainment. |
| 15 | Stencil | Stencil with or without frame (offered free by SMTFAB) |
| 16 | Quality Inspection | Visual inspection; AOI checking; BGA placement – X-RAY checking |
| 17 | SMT Capacity | 3 Million~4 Million Soldering Pad/day |
| 18 | DIP Capacity | 100 Thousand Pins/day |
1, What Is Laser Stencil?
It’s a solder-paste stencil that has been laser cut. The paste is applied through the stencil, the thickness of the stencil determining the quantity of paste applied.
2, How Do You Use A Laser Cut Stencil?
3, What Is The Best Material For Making Stencils?
The most common material for stencils is Mylar – and for good reason. It is flexible, durable, easy to clean, and long-lasting. 10mil Mylar is our preferred thickness for its flexibility, durability, and versatility. Other options include adhesive-backed mylar, magnetic, acrylic, or wood stencils.
4, What Is PCB Stencil?
A PCB Stencil is a sheet of stainless steel with laser-cut openings used to place solder paste on a PCB board for surface mount component placement. The PCB stencil is used to deposit solder paste on designated places on a bare PCB board so that components can be placed and perfectly aligned on the board.
5, How Do You Clean Solder Stencils?
Currently, as needed, our EMS contractor wipes the bottom side (board contact side) of each solder paste stencil using lint-free wipes saturated with IPA. Then once every 4 hours they remove each solder paste stencil from the screen printers and wipe both sides using IPA saturated lint-free wipes.
6, Do You Need Flux To Solder Wire?
Additional flux is unnecessary for most applications, but using additional flux still may make the solder easier to work with for some tasks. When selecting flux core solder, it is important to use rosin core solder for electrical applications. Acid core solder should only be used for plumbing applications.
| No. | Item | Process Capability Parameter |
| 1 | Order Quantity | ≥1PC |
| 2 | Quality Grade | IPC-A-610 |
| 3 | Lead Time | 24 hours expedited service can be offered. 3- 4 days normally for PCBA prototype orders. We will give you an accurate lead time when we quote for you. |
| 4 | Size | 50*50mm~510*460mm |
| 5 | Board Type | Rigid PCB, Flexible PCB, metal core PCB |
| 6 | Min Package | 01005 (0.4mm*0.2mm) |
| 7 | Max Package | No limit |
| 8 | Mounting Accuracy | ±0.035mm(±0.025mm) Cpk≥1.0 (3σ) |
| 9 | Surface Finish | Lead/Lead-free HASL, Immersion gold, OPS etc. |
| 10 | Assembly Types | Surface mount (SMT), Through-hole (DIP), Mixed Technology (SMT & Thru-hole) |
| 11 | Component Sourcing | Turnkey (All components sourced by SMTFAB), Partial turnkey, Kitted/Consigned |
| 12 | BGA Package | BGA Dia. 0.14mm, BGA 0.2mm pitch |
| 13 | SMT Parts Presentation | Cut Tape, Partial reel, Reel, Tube, Tray, Laser-cut Stainless Steel |
| 14 | Cable Assembly | We supply custom cables, cable assemblies, wiring looms/harnesses and power leads for various industries including automotive, security, mining, medical, and entertainment. |
| 15 | Stencil | Stencil with or without frame (offered free by SMTFAB) |
| 16 | Quality Inspection | Visual inspection; AOI checking; BGA placement – X-RAY checking |
| 17 | SMT Capacity | 3 Million~4 Million Soldering Pad/day |
| 18 | DIP Capacity | 100 Thousand Pins/day |
1, What Is Laser Stencil?
It’s a solder-paste stencil that has been laser cut. The paste is applied through the stencil, the thickness of the stencil determining the quantity of paste applied.
2, How Do You Use A Laser Cut Stencil?
3, What Is The Best Material For Making Stencils?
The most common material for stencils is Mylar – and for good reason. It is flexible, durable, easy to clean, and long-lasting. 10mil Mylar is our preferred thickness for its flexibility, durability, and versatility. Other options include adhesive-backed mylar, magnetic, acrylic, or wood stencils.
4, What Is PCB Stencil?
A PCB Stencil is a sheet of stainless steel with laser-cut openings used to place solder paste on a PCB board for surface mount component placement. The PCB stencil is used to deposit solder paste on designated places on a bare PCB board so that components can be placed and perfectly aligned on the board.
5, How Do You Clean Solder Stencils?
Currently, as needed, our EMS contractor wipes the bottom side (board contact side) of each solder paste stencil using lint-free wipes saturated with IPA. Then once every 4 hours they remove each solder paste stencil from the screen printers and wipe both sides using IPA saturated lint-free wipes.
6, Do You Need Flux To Solder Wire?
Additional flux is unnecessary for most applications, but using additional flux still may make the solder easier to work with for some tasks. When selecting flux core solder, it is important to use rosin core solder for electrical applications. Acid core solder should only be used for plumbing applications.
| No. | Item | Process Capability Parameter |
| 1 | Order Quantity | ≥1PC |
| 2 | Quality Grade | IPC-A-610 |
| 3 | Lead Time | 24 hours expedited service can be offered. 3- 4 days normally for PCBA prototype orders. We will give you an accurate lead time when we quote for you. |
| 4 | Size | 50*50mm~510*460mm |
| 5 | Board Type | Rigid PCB, Flexible PCB, metal core PCB |
| 6 | Min Package | 01005 (0.4mm*0.2mm) |
| 7 | Max Package | No limit |
| 8 | Mounting Accuracy | ±0.035mm(±0.025mm) Cpk≥1.0 (3σ) |
| 9 | Surface Finish | Lead/Lead-free HASL, Immersion gold, OPS etc. |
| 10 | Assembly Types | Surface mount (SMT), Through-hole (DIP), Mixed Technology (SMT & Thru-hole) |
| 11 | Component Sourcing | Turnkey (All components sourced by SMTFAB), Partial turnkey, Kitted/Consigned |
| 12 | BGA Package | BGA Dia. 0.14mm, BGA 0.2mm pitch |
| 13 | SMT Parts Presentation | Cut Tape, Partial reel, Reel, Tube, Tray, Laser-cut Stainless Steel |
| 14 | Cable Assembly | We supply custom cables, cable assemblies, wiring looms/harnesses and power leads for various industries including automotive, security, mining, medical, and entertainment. |
| 15 | Stencil | Stencil with or without frame (offered free by SMTFAB) |
| 16 | Quality Inspection | Visual inspection; AOI checking; BGA placement – X-RAY checking |
| 17 | SMT Capacity | 3 Million~4 Million Soldering Pad/day |
| 18 | DIP Capacity | 100 Thousand Pins/day |
| No. | Item | Process Capability Parameter |
| 1 | Order Quantity | ≥1PC |
| 2 | Quality Grade | IPC-A-610 |
| 3 | Lead Time | 24 hours expedited service can be offered. 3- 4 days normally for PCBA prototype orders. We will give you an accurate lead time when we quote for you. |
| 4 | Size | 50*50mm~510*460mm |
| 5 | Board Type | Rigid PCB, Flexible PCB, metal core PCB |
| 6 | Min Package | 01005 (0.4mm*0.2mm) |
| 7 | Max Package | No limit |
| 8 | Mounting Accuracy | ±0.035mm(±0.025mm) Cpk≥1.0 (3σ) |
| 9 | Surface Finish | Lead/Lead-free HASL, Immersion gold, OPS etc. |
| 10 | Assembly Types | Surface mount (SMT), Through-hole (DIP), Mixed Technology (SMT & Thru-hole) |
| 11 | Component Sourcing | Turnkey (All components sourced by SMTFAB), Partial turnkey, Kitted/Consigned |
| 12 | BGA Package | BGA Dia. 0.14mm, BGA 0.2mm pitch |
| 13 | SMT Parts Presentation | Cut Tape, Partial reel, Reel, Tube, Tray, Laser-cut Stainless Steel |
| 14 | Cable Assembly | We supply custom cables, cable assemblies, wiring looms/harnesses and power leads for various industries including automotive, security, mining, medical, and entertainment. |
| 15 | Stencil | Stencil with or without frame (offered free by SMTFAB) |
| 16 | Quality Inspection | Visual inspection; AOI checking; BGA placement – X-RAY checking |
| 17 | SMT Capacity | 3 Million~4 Million Soldering Pad/day |
| 18 | DIP Capacity | 100 Thousand Pins/day |
1, What Is Laser Stencil?
It’s a solder-paste stencil that has been laser cut. The paste is applied through the stencil, the thickness of the stencil determining the quantity of paste applied.
2, How Do You Use A Laser Cut Stencil?
3, What Is The Best Material For Making Stencils?
The most common material for stencils is Mylar – and for good reason. It is flexible, durable, easy to clean, and long-lasting. 10mil Mylar is our preferred thickness for its flexibility, durability, and versatility. Other options include adhesive-backed mylar, magnetic, acrylic, or wood stencils.
4, What Is PCB Stencil?
A PCB Stencil is a sheet of stainless steel with laser-cut openings used to place solder paste on a PCB board for surface mount component placement. The PCB stencil is used to deposit solder paste on designated places on a bare PCB board so that components can be placed and perfectly aligned on the board.
5, How Do You Clean Solder Stencils?
Currently, as needed, our EMS contractor wipes the bottom side (board contact side) of each solder paste stencil using lint-free wipes saturated with IPA. Then once every 4 hours they remove each solder paste stencil from the screen printers and wipe both sides using IPA saturated lint-free wipes.
6, Do You Need Flux To Solder Wire?
Additional flux is unnecessary for most applications, but using additional flux still may make the solder easier to work with for some tasks. When selecting flux core solder, it is important to use rosin core solder for electrical applications. Acid core solder should only be used for plumbing applications.
1, What Is Laser Stencil?
It’s a solder-paste stencil that has been laser cut. The paste is applied through the stencil, the thickness of the stencil determining the quantity of paste applied.
2, How Do You Use A Laser Cut Stencil?
3, What Is The Best Material For Making Stencils?
The most common material for stencils is Mylar – and for good reason. It is flexible, durable, easy to clean, and long-lasting. 10mil Mylar is our preferred thickness for its flexibility, durability, and versatility. Other options include adhesive-backed mylar, magnetic, acrylic, or wood stencils.
4, What Is PCB Stencil?
A PCB Stencil is a sheet of stainless steel with laser-cut openings used to place solder paste on a PCB board for surface mount component placement. The PCB stencil is used to deposit solder paste on designated places on a bare PCB board so that components can be placed and perfectly aligned on the board.
5, How Do You Clean Solder Stencils?
Currently, as needed, our EMS contractor wipes the bottom side (board contact side) of each solder paste stencil using lint-free wipes saturated with IPA. Then once every 4 hours they remove each solder paste stencil from the screen printers and wipe both sides using IPA saturated lint-free wipes.
6, Do You Need Flux To Solder Wire?
Additional flux is unnecessary for most applications, but using additional flux still may make the solder easier to work with for some tasks. When selecting flux core solder, it is important to use rosin core solder for electrical applications. Acid core solder should only be used for plumbing applications.
Are you looking for a professional laser stencil manufacturer in China? SMTFAB is your best choice.
We can provide frame stencils and frameless stencils for you. It depends on the type of laser stencil you use, you can apply the paste with hands or a machine.
When you design the laser stencil, please pay close attention to these characters like the thickness of the stencil, aperture size, size of the laser stencil, and durability.
Our PCB assembly plant has a workshop of 8,000 square meters and over 500 workers. There are 6 fully automatic SMT production lines, 3 wave soldering production lines, 5 assembly lines, and auxiliary testing and aging facilities.
Whoever you are an electrical engineer, a purchasing manager, a project manager, or a product designer looking for a laser stencil of PCB assembly, SMTFAB will be your excellent laser stencil and PCB assembly supplier in China.
Send us your Gerber data and BOM list files, you will get an awesome product.
Laser Stencils or calls SMT Stencils are used to print solder paste on the PCBs for assembly components.
They are often made of Stainless Steel and are manufactured by processes of laser cut or etching.
Stencil Stencil is the process of depositing solder paste on the PCB to establish electrical connections.
it is to achieve through a single material namely solder paste which consists of solder metal and flux.
The equipment and materials used in this stage are laser stencil, solder paste, and Paste printer.
In order to meet a good solder joint, the right volume of solder paste needs to be printed, the component needs to be placed in the right solder pads, the solder paste needs to wet well on the board, and also must be clean enough for SMT stencil printing.
With laser stencil technology, it is possible to create durable stencils in wood, Plexiglas, polypropylene, or pressed cardboard for a few dozen sprays according to your needs.
In order to be able to solder SMD components on the circuit board, a sufficient solder depot must be available.
The end surfaces on the circuit board, such as HAL, are usually not sufficient for this.
For this reason, a solder paste is applied to the pads for SMD components.
The paste is applied with a laser-cut metal template. This is commonly referred to as an SMD stencil or stencil.
So that the SMD components cannot slip on the circuit board during the soldering process, they are fixed with an adhesive.
The adhesive can also be applied using a laser-cut metal template.

laser Stencil
Sufficiently smooth walls and tapered apertures. This ensures that the solder paste easily passes through the apertures of the stencil when it is lifted from the print cycle.
The solution to the problem of making precision stencils was again proposed by laser processing of the material.
After all, the necessary holes do not have to be made by chemical etching.
They can also be made by direct laser processing of the material. In this case, on the one hand, it is possible to significantly increase the accuracy of maintaining the required hole shape.
And on the other hand, the hole profile can be much closer to rectangular.
The dosage of the solder paste applied using such Laser Stencil will be much more accurate.
It will drastically reduce the rejects during soldering. In addition, after laser processing, the holes have a slightly trapezoidal wall shape.
The open portion of the aperture is usually slightly larger on the lower side.
This shape of the hole provides better peeling of the solder paste from the walls of the hole when removing the stencil.
The second significant advantage of Laser Stencil is the material used for their manufacture.
The absence of photochemical etching operations made it possible to abandon the use of special grades of bronze.
For the manufacture of stencils by laser processing, tough grades of stainless steel are used.
It resists wearing significantly better than metals suitable for photochemical etching.
When creating printed circuit boards of varying complexity, the methods of SMD and DIP mounting of elements are used.
The first method of fixing components is applied after applying solder paste.
Stencils for surface mounting are used for its distribution. Their use in the preparation process is characterized by many advantages:
The clarity of the lines along which the solder paste is distributed and its dosage directly affect the quality of the installation.
Since the pins of the surface components are at the same level, the track heights or contours of the pads are not allowed.
It is not possible to achieve perfectly uniform distribution even in manual mode.
Since squeezing the paste out of the syringe does not guarantee an accurate dosage.

Paste on PCB
Products for precise distribution and dosing of solder paste are:
Stencils of the first type are plates in which the apertures are at the same level.
They are used for most printed circuit boards. Their use is relevant in cases when it is required to fix elements with leads of the same length on the plate.
More complex printed circuit boards are often created using chips of different sizes.
In this case, the conclusions of some elements are shorter, others are longer.
To solder them, it is required to apply the paste in layers of different thicknesses.
In such cases, Laser Stencil is required. They are plates with protruding or recessed areas against the background of the main surface.
If the platform protrudes, then the walls of the apertures have a greater height. The paste is spread over them in thicker layers.
If the platform is recessed, then the walls of the apertures have a lower height. Accordingly, the paste is distributed over them in thin layers.

Paste for PCB
Here at SMTFAB, we could provide custom stencils of different sizes and thicknesses, when you have this kind of laser stencil or SMT stencil, please send the inquiry to us.
Are you looking for a professional laser stencil manufacturer in China? SMTFAB is your best choice.
We can provide frame stencils and frameless stencils for you. It depends on the type of laser stencil you use, you can apply the paste with hands or a machine.
When you design the laser stencil, please pay close attention to these characters like the thickness of the stencil, aperture size, size of the laser stencil, and durability.
Our PCB assembly plant has a workshop of 8,000 square meters and over 500 workers. There are 6 fully automatic SMT production lines, 3 wave soldering production lines, 5 assembly lines, and auxiliary testing and aging facilities.
Whoever you are an electrical engineer, a purchasing manager, a project manager, or a product designer looking for a laser stencil of PCB assembly, SMTFAB will be your excellent laser stencil and PCB assembly supplier in China.
Send us your Gerber data and BOM list files, you will get an awesome product.
Laser Stencils or calls SMT Stencils are used to print solder paste on the PCBs for assembly components.
They are often made of Stainless Steel and are manufactured by processes of laser cut or etching.
Stencil Stencil is the process of depositing solder paste on the PCB to establish electrical connections.
it is to achieve through a single material namely solder paste which consists of solder metal and flux.
The equipment and materials used in this stage are laser stencil, solder paste, and Paste printer.
In order to meet a good solder joint, the right volume of solder paste needs to be printed, the component needs to be placed in the right solder pads, the solder paste needs to wet well on the board, and also must be clean enough for SMT stencil printing.
With laser stencil technology, it is possible to create durable stencils in wood, Plexiglas, polypropylene, or pressed cardboard for a few dozen sprays according to your needs.
In order to be able to solder SMD components on the circuit board, a sufficient solder depot must be available.
The end surfaces on the circuit board, such as HAL, are usually not sufficient for this.
For this reason, a solder paste is applied to the pads for SMD components.
The paste is applied with a laser-cut metal template. This is commonly referred to as an SMD stencil or stencil.
So that the SMD components cannot slip on the circuit board during the soldering process, they are fixed with an adhesive.
The adhesive can also be applied using a laser-cut metal template.

laser Stencil
Sufficiently smooth walls and tapered apertures. This ensures that the solder paste easily passes through the apertures of the stencil when it is lifted from the print cycle.
The solution to the problem of making precision stencils was again proposed by laser processing of the material.
After all, the necessary holes do not have to be made by chemical etching.
They can also be made by direct laser processing of the material. In this case, on the one hand, it is possible to significantly increase the accuracy of maintaining the required hole shape.
And on the other hand, the hole profile can be much closer to rectangular.
The dosage of the solder paste applied using such Laser Stencil will be much more accurate.
It will drastically reduce the rejects during soldering. In addition, after laser processing, the holes have a slightly trapezoidal wall shape.
The open portion of the aperture is usually slightly larger on the lower side.
This shape of the hole provides better peeling of the solder paste from the walls of the hole when removing the stencil.
The second significant advantage of Laser Stencil is the material used for their manufacture.
The absence of photochemical etching operations made it possible to abandon the use of special grades of bronze.
For the manufacture of stencils by laser processing, tough grades of stainless steel are used.
It resists wearing significantly better than metals suitable for photochemical etching.
When creating printed circuit boards of varying complexity, the methods of SMD and DIP mounting of elements are used.
The first method of fixing components is applied after applying solder paste.
Stencils for surface mounting are used for its distribution. Their use in the preparation process is characterized by many advantages:
The clarity of the lines along which the solder paste is distributed and its dosage directly affect the quality of the installation.
Since the pins of the surface components are at the same level, the track heights or contours of the pads are not allowed.
It is not possible to achieve perfectly uniform distribution even in manual mode.
Since squeezing the paste out of the syringe does not guarantee an accurate dosage.

Paste on PCB
Products for precise distribution and dosing of solder paste are:
Stencils of the first type are plates in which the apertures are at the same level.
They are used for most printed circuit boards. Their use is relevant in cases when it is required to fix elements with leads of the same length on the plate.
More complex printed circuit boards are often created using chips of different sizes.
In this case, the conclusions of some elements are shorter, others are longer.
To solder them, it is required to apply the paste in layers of different thicknesses.
In such cases, Laser Stencil is required. They are plates with protruding or recessed areas against the background of the main surface.
If the platform protrudes, then the walls of the apertures have a greater height. The paste is spread over them in thicker layers.
If the platform is recessed, then the walls of the apertures have a lower height. Accordingly, the paste is distributed over them in thin layers.

Paste for PCB
Here at SMTFAB, we could provide custom stencils of different sizes and thicknesses, when you have this kind of laser stencil or SMT stencil, please send the inquiry to us.
Are you looking for a professional laser stencil manufacturer in China? SMTFAB is your best choice.
We can provide frame stencils and frameless stencils for you. It depends on the type of laser stencil you use, you can apply the paste with hands or a machine.
When you design the laser stencil, please pay close attention to these characters like the thickness of the stencil, aperture size, size of the laser stencil, and durability.
Our PCB assembly plant has a workshop of 8,000 square meters and over 500 workers. There are 6 fully automatic SMT production lines, 3 wave soldering production lines, 5 assembly lines, and auxiliary testing and aging facilities.
Whoever you are an electrical engineer, a purchasing manager, a project manager, or a product designer looking for a laser stencil of PCB assembly, SMTFAB will be your excellent laser stencil and PCB assembly supplier in China.
Send us your Gerber data and BOM list files, you will get an awesome product.
Laser Stencils or calls SMT Stencils are used to print solder paste on the PCBs for assembly components.
They are often made of Stainless Steel and are manufactured by processes of laser cut or etching.
Stencil Stencil is the process of depositing solder paste on the PCB to establish electrical connections.
it is to achieve through a single material namely solder paste which consists of solder metal and flux.
The equipment and materials used in this stage are laser stencil, solder paste, and Paste printer.
In order to meet a good solder joint, the right volume of solder paste needs to be printed, the component needs to be placed in the right solder pads, the solder paste needs to wet well on the board, and also must be clean enough for SMT stencil printing.
With laser stencil technology, it is possible to create durable stencils in wood, Plexiglas, polypropylene, or pressed cardboard for a few dozen sprays according to your needs.
In order to be able to solder SMD components on the circuit board, a sufficient solder depot must be available.
The end surfaces on the circuit board, such as HAL, are usually not sufficient for this.
For this reason, a solder paste is applied to the pads for SMD components.
The paste is applied with a laser-cut metal template. This is commonly referred to as an SMD stencil or stencil.
So that the SMD components cannot slip on the circuit board during the soldering process, they are fixed with an adhesive.
The adhesive can also be applied using a laser-cut metal template.

laser Stencil
Sufficiently smooth walls and tapered apertures. This ensures that the solder paste easily passes through the apertures of the stencil when it is lifted from the print cycle.
The solution to the problem of making precision stencils was again proposed by laser processing of the material.
After all, the necessary holes do not have to be made by chemical etching.
They can also be made by direct laser processing of the material. In this case, on the one hand, it is possible to significantly increase the accuracy of maintaining the required hole shape.
And on the other hand, the hole profile can be much closer to rectangular.
The dosage of the solder paste applied using such Laser Stencil will be much more accurate.
It will drastically reduce the rejects during soldering. In addition, after laser processing, the holes have a slightly trapezoidal wall shape.
The open portion of the aperture is usually slightly larger on the lower side.
This shape of the hole provides better peeling of the solder paste from the walls of the hole when removing the stencil.
The second significant advantage of Laser Stencil is the material used for their manufacture.
The absence of photochemical etching operations made it possible to abandon the use of special grades of bronze.
For the manufacture of stencils by laser processing, tough grades of stainless steel are used.
It resists wearing significantly better than metals suitable for photochemical etching.
When creating printed circuit boards of varying complexity, the methods of SMD and DIP mounting of elements are used.
The first method of fixing components is applied after applying solder paste.
Stencils for surface mounting are used for its distribution. Their use in the preparation process is characterized by many advantages:
The clarity of the lines along which the solder paste is distributed and its dosage directly affect the quality of the installation.
Since the pins of the surface components are at the same level, the track heights or contours of the pads are not allowed.
It is not possible to achieve perfectly uniform distribution even in manual mode.
Since squeezing the paste out of the syringe does not guarantee an accurate dosage.

Paste on PCB
Products for precise distribution and dosing of solder paste are:
Stencils of the first type are plates in which the apertures are at the same level.
They are used for most printed circuit boards. Their use is relevant in cases when it is required to fix elements with leads of the same length on the plate.
More complex printed circuit boards are often created using chips of different sizes.
In this case, the conclusions of some elements are shorter, others are longer.
To solder them, it is required to apply the paste in layers of different thicknesses.
In such cases, Laser Stencil is required. They are plates with protruding or recessed areas against the background of the main surface.
If the platform protrudes, then the walls of the apertures have a greater height. The paste is spread over them in thicker layers.
If the platform is recessed, then the walls of the apertures have a lower height. Accordingly, the paste is distributed over them in thin layers.

Paste for PCB
Here at SMTFAB, we could provide custom stencils of different sizes and thicknesses, when you have this kind of laser stencil or SMT stencil, please send the inquiry to us.
Are you looking for a professional laser stencil manufacturer in China? SMTFAB is your best choice.
We can provide frame stencils and frameless stencils for you. It depends on the type of laser stencil you use, you can apply the paste with hands or a machine.
When you design the laser stencil, please pay close attention to these characters like the thickness of the stencil, aperture size, size of the laser stencil, and durability.
Our PCB assembly plant has a workshop of 8,000 square meters and over 500 workers. There are 6 fully automatic SMT production lines, 3 wave soldering production lines, 5 assembly lines, and auxiliary testing and aging facilities.
Whoever you are an electrical engineer, a purchasing manager, a project manager, or a product designer looking for a laser stencil of PCB assembly, SMTFAB will be your excellent laser stencil and PCB assembly supplier in China.
Send us your Gerber data and BOM list files, you will get an awesome product.
Laser Stencils or calls SMT Stencils are used to print solder paste on the PCBs for assembly components.
They are often made of Stainless Steel and are manufactured by processes of laser cut or etching.
Stencil Stencil is the process of depositing solder paste on the PCB to establish electrical connections.
it is to achieve through a single material namely solder paste which consists of solder metal and flux.
The equipment and materials used in this stage are laser stencil, solder paste, and Paste printer.
In order to meet a good solder joint, the right volume of solder paste needs to be printed, the component needs to be placed in the right solder pads, the solder paste needs to wet well on the board, and also must be clean enough for SMT stencil printing.
With laser stencil technology, it is possible to create durable stencils in wood, Plexiglas, polypropylene, or pressed cardboard for a few dozen sprays according to your needs.
In order to be able to solder SMD components on the circuit board, a sufficient solder depot must be available.
The end surfaces on the circuit board, such as HAL, are usually not sufficient for this.
For this reason, a solder paste is applied to the pads for SMD components.
The paste is applied with a laser-cut metal template. This is commonly referred to as an SMD stencil or stencil.
So that the SMD components cannot slip on the circuit board during the soldering process, they are fixed with an adhesive.
The adhesive can also be applied using a laser-cut metal template.

laser Stencil
Sufficiently smooth walls and tapered apertures. This ensures that the solder paste easily passes through the apertures of the stencil when it is lifted from the print cycle.
The solution to the problem of making precision stencils was again proposed by laser processing of the material.
After all, the necessary holes do not have to be made by chemical etching.
They can also be made by direct laser processing of the material. In this case, on the one hand, it is possible to significantly increase the accuracy of maintaining the required hole shape.
And on the other hand, the hole profile can be much closer to rectangular.
The dosage of the solder paste applied using such Laser Stencil will be much more accurate.
It will drastically reduce the rejects during soldering. In addition, after laser processing, the holes have a slightly trapezoidal wall shape.
The open portion of the aperture is usually slightly larger on the lower side.
This shape of the hole provides better peeling of the solder paste from the walls of the hole when removing the stencil.
The second significant advantage of Laser Stencil is the material used for their manufacture.
The absence of photochemical etching operations made it possible to abandon the use of special grades of bronze.
For the manufacture of stencils by laser processing, tough grades of stainless steel are used.
It resists wearing significantly better than metals suitable for photochemical etching.
When creating printed circuit boards of varying complexity, the methods of SMD and DIP mounting of elements are used.
The first method of fixing components is applied after applying solder paste.
Stencils for surface mounting are used for its distribution. Their use in the preparation process is characterized by many advantages:
The clarity of the lines along which the solder paste is distributed and its dosage directly affect the quality of the installation.
Since the pins of the surface components are at the same level, the track heights or contours of the pads are not allowed.
It is not possible to achieve perfectly uniform distribution even in manual mode.
Since squeezing the paste out of the syringe does not guarantee an accurate dosage.

Paste on PCB
Products for precise distribution and dosing of solder paste are:
Stencils of the first type are plates in which the apertures are at the same level.
They are used for most printed circuit boards. Their use is relevant in cases when it is required to fix elements with leads of the same length on the plate.
More complex printed circuit boards are often created using chips of different sizes.
In this case, the conclusions of some elements are shorter, others are longer.
To solder them, it is required to apply the paste in layers of different thicknesses.
In such cases, Laser Stencil is required. They are plates with protruding or recessed areas against the background of the main surface.
If the platform protrudes, then the walls of the apertures have a greater height. The paste is spread over them in thicker layers.
If the platform is recessed, then the walls of the apertures have a lower height. Accordingly, the paste is distributed over them in thin layers.

Paste for PCB
Here at SMTFAB, we could provide custom stencils of different sizes and thicknesses, when you have this kind of laser stencil or SMT stencil, please send the inquiry to us.
Are you looking for a professional laser stencil manufacturer in China? SMTFAB is your best choice.
We can provide frame stencils and frameless stencils for you. It depends on the type of laser stencil you use, you can apply the paste with hands or a machine.
When you design the laser stencil, please pay close attention to these characters like the thickness of the stencil, aperture size, size of the laser stencil, and durability.
Our PCB assembly plant has a workshop of 8,000 square meters and over 500 workers. There are 6 fully automatic SMT production lines, 3 wave soldering production lines, 5 assembly lines, and auxiliary testing and aging facilities.
Whoever you are an electrical engineer, a purchasing manager, a project manager, or a product designer looking for a laser stencil of PCB assembly, SMTFAB will be your excellent laser stencil and PCB assembly supplier in China.
Send us your Gerber data and BOM list files, you will get an awesome product.
Laser Stencils or calls SMT Stencils are used to print solder paste on the PCBs for assembly components.
They are often made of Stainless Steel and are manufactured by processes of laser cut or etching.
Stencil Stencil is the process of depositing solder paste on the PCB to establish electrical connections.
it is to achieve through a single material namely solder paste which consists of solder metal and flux.
The equipment and materials used in this stage are laser stencil, solder paste, and Paste printer.
In order to meet a good solder joint, the right volume of solder paste needs to be printed, the component needs to be placed in the right solder pads, the solder paste needs to wet well on the board, and also must be clean enough for SMT stencil printing.
With laser stencil technology, it is possible to create durable stencils in wood, Plexiglas, polypropylene, or pressed cardboard for a few dozen sprays according to your needs.
In order to be able to solder SMD components on the circuit board, a sufficient solder depot must be available.
The end surfaces on the circuit board, such as HAL, are usually not sufficient for this.
For this reason, a solder paste is applied to the pads for SMD components.
The paste is applied with a laser-cut metal template. This is commonly referred to as an SMD stencil or stencil.
So that the SMD components cannot slip on the circuit board during the soldering process, they are fixed with an adhesive.
The adhesive can also be applied using a laser-cut metal template.
Sufficiently smooth walls and tapered apertures. This ensures that the solder paste easily passes through the apertures of the stencil when it is lifted from the print cycle.
The solution to the problem of making precision stencils was again proposed by laser processing of the material.
After all, the necessary holes do not have to be made by chemical etching.
They can also be made by direct laser processing of the material. In this case, on the one hand, it is possible to significantly increase the accuracy of maintaining the required hole shape.
And on the other hand, the hole profile can be much closer to rectangular.
The dosage of the solder paste applied using such Laser Stencil will be much more accurate.
It will drastically reduce the rejects during soldering. In addition, after laser processing, the holes have a slightly trapezoidal wall shape.
The open portion of the aperture is usually slightly larger on the lower side.
This shape of the hole provides better peeling of the solder paste from the walls of the hole when removing the stencil.
The second significant advantage of Laser Stencil is the material used for their manufacture.
The absence of photochemical etching operations made it possible to abandon the use of special grades of bronze.
For the manufacture of stencils by laser processing, tough grades of stainless steel are used.
It resists wearing significantly better than metals suitable for photochemical etching.
When creating printed circuit boards of varying complexity, the methods of SMD and DIP mounting of elements are used.
The first method of fixing components is applied after applying solder paste.
Stencils for surface mounting are used for its distribution. Their use in the preparation process is characterized by many advantages:
The clarity of the lines along which the solder paste is distributed and its dosage directly affect the quality of the installation.
Since the pins of the surface components are at the same level, the track heights or contours of the pads are not allowed.
It is not possible to achieve perfectly uniform distribution even in manual mode.
Since squeezing the paste out of the syringe does not guarantee an accurate dosage.
Products for precise distribution and dosing of solder paste are:
Stencils of the first type are plates in which the apertures are at the same level.
They are used for most printed circuit boards. Their use is relevant in cases when it is required to fix elements with leads of the same length on the plate.
More complex printed circuit boards are often created using chips of different sizes.
In this case, the conclusions of some elements are shorter, others are longer.
To solder them, it is required to apply the paste in layers of different thicknesses.
In such cases, Laser Stencil is required. They are plates with protruding or recessed areas against the background of the main surface.
If the platform protrudes, then the walls of the apertures have a greater height. The paste is spread over them in thicker layers.
If the platform is recessed, then the walls of the apertures have a lower height. Accordingly, the paste is distributed over them in thin layers.
Here at SMTFAB, we could provide custom stencils of different sizes and thicknesses, when you have this kind of laser stencil or SMT stencil, please send the inquiry to us.
Contact us today for a custom quote and expert consultation